Camera module and imaging apparatus including the same
US-11949975-B2 · Apr 2, 2024 · US
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Jun Hyunsu patents
Jun Hyunsu is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jun Hyunsu |
| Total patents | 29 |
| First publication | Nov 12, 2015 |
| Latest publication | Apr 2, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-input folded camera and mobile device including the same
US-11914271-B2 · Feb 27, 2024 · US
Camera module and imaging apparatus including the same
US-11563874-B2 · Jan 24, 2023 · US
Semiconductor package and method of fabricating the same
US-11482554-B2 · Oct 25, 2022 · US
Multi-input folded camera and mobile device including the same
US-2022317550-A1 · Oct 6, 2022 · US
Multi-input folded camera and mobile device including the same
US-11392012-B2 · Jul 19, 2022 · US
Sensor device
US-11380726-B2 · Jul 5, 2022 · US
Camera module and imaging apparatus including the same
US-2022132011-A1 · Apr 28, 2022 · US
Camera module and imaging apparatus including the same
US-11252308-B2 · Feb 15, 2022 · US
Camera module and imaging apparatus including the same
US-2022021794-A1 · Jan 20, 2022 · US
Recent patents
Latest publications not already listed above.
Image sensor package
US-11218651-B2 · Jan 4, 2022 · US
Light-folding camera and mobile device including the same
US-11086099-B2 · Aug 10, 2021 · US
Sensor device
US-2021134871-A1 · May 6, 2021 · US
Multi-input folded camera and mobile device including the same
US-2021116791-A1 · Apr 22, 2021 · US
Light-folding camera and mobile device including the same
US-2021048605-A1 · Feb 18, 2021 · US
Camera module and imaging apparatus including the same
US-2020412922-A1 · Dec 31, 2020 · US
Method of fabricating semiconductor package
US-10868073-B2 · Dec 15, 2020 · US
Image sensor package
US-2020366853-A1 · Nov 19, 2020 · US
Semiconductor package and method of fabricating the same
US-2020303445-A1 · Sep 24, 2020 · US
Method of fabricating semiconductor package
US-2019074316-A1 · Mar 7, 2019 · US
Semiconductor package and method of fabricating the same
US-10177188-B2 · Jan 8, 2019 · US
Semiconductor package
US-10008533-B2 · Jun 26, 2018 · US
Package for image sensor with outer and inner frames
US-9966401-B2 · May 8, 2018 · US
Semiconductor package and method of fabricating the same
US-2018040658-A1 · Feb 8, 2018 · US
Semiconductor package and method of fabricating the same
US-2017179182-A1 · Jun 22, 2017 · US
Semiconductor packages including electrical insulation features
US-9634046-B2 · Apr 25, 2017 · US
Semiconductor package and method for manufacturing the same
US-2016260761-A1 · Sep 8, 2016 · US
Semiconductor Package and Method for Manufacturing the Same
US-2016005778-A1 · Jan 7, 2016 · US
Semiconductor packages including electrical insulation features
US-2015325611-A1 · Nov 12, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 29 |
| Jun Hyunsu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10F39/804 | 15 |
| H10F39/811 | 15 |
| H01L27/14636 | 13 |
| H01L27/14618 | 13 |
| H04N23/57 | 12 |