Wafer level multi form factor die singulation
US-2026096368-A1 · Apr 2, 2026 · US
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Jayaraman Saikumar patents
Jayaraman Saikumar is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jayaraman Saikumar |
| Total patents | 43 |
| First publication | Jan 26, 2016 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Self-locking optical connector for photonic integrated circuits
US-2026003144-A1 · Jan 1, 2026 · US
Graded index (grin) lens expanded beam (eb) coupler for detachable fiber array unit (fau)
US-2025362456-A1 · Nov 27, 2025 · US
Photonic integrated circuit packages including an on-package expanded beam connector for detachable fiber array
US-2025306303-A1 · Oct 2, 2025 · US
Tapered optical features for optical fiber connections
US-2025306287-A1 · Oct 2, 2025 · US
Photonic integrated circuit packages including an on-package expanded beam connector for detachable fiber array
US-2025306302-A1 · Oct 2, 2025 · US
Passive lens array structure for photonic integrated circuit (pic)
US-2025306285-A1 · Oct 2, 2025 · US
Expanded beam fiber array unit using spliced photonic crystal and mode field adapter fibers
US-2025306318-A1 · Oct 2, 2025 · US
Package with optical connector
US-2025306297-A1 · Oct 2, 2025 · US
Expanded beam optical coupling with a ball lens
US-2025306290-A1 · Oct 2, 2025 · US
Recent patents
Latest publications not already listed above.
Adhesive-free expanded beam fiber array unit (fau)
US-2025306281-A1 · Oct 2, 2025 · US
On-Package Self-Aligning Expanded-Beam Connector
US-2025306294-A1 · Oct 2, 2025 · US
Sinterable nanoparticles for organic-free optical adhesives
US-2025306307-A1 · Oct 2, 2025 · US
Heat spreaders for optical fiber array interconnects
US-2025306313-A1 · Oct 2, 2025 · US
Fiber array unit for high density optical fiber connections to photonic integrated circuit shorelines
US-2025306304-A1 · Oct 2, 2025 · US
Micro socket electrical couplings for dies
US-12341281-B2 · Jun 24, 2025 · US
Polyethylene oxide-based optical adhesive
US-2025110295-A1 · Apr 3, 2025 · US
Technologies for fiber array unit lid designs
US-2025102744-A1 · Mar 27, 2025 · US
Photonic integrated circuit within a cavity of interposer
US-2025004223-A1 · Jan 2, 2025 · US
Systems and methods for device authentication in supply chain
US-12088695-B2 · Sep 10, 2024 · US
Methods and tools for preventing the counterfeiting and tampering of semiconductor devices
US-2024054502-A1 · Feb 15, 2024 · US
Thermally-optimized tunable stack in cavity package-on-package
US-11769753-B2 · Sep 26, 2023 · US
Architecture and processes to enable high capacity memory packages through memory die stacking
US-11456281-B2 · Sep 27, 2022 · US
Micro socket electrical couplings for dies
US-2022200183-A1 · Jun 23, 2022 · US
Systems and methods for device authentication in supply chain
US-2022116206-A1 · Apr 14, 2022 · US
Architecture and processes to enable high capacity memory packages through memory die stacking
US-2020105719-A1 · Apr 2, 2020 · US
Thermally-optimized tunable stack in cavity package-on-package
US-2020043894-A1 · Feb 6, 2020 · US
Pillar based socket
US-10522450-B1 · Dec 31, 2019 · US
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
US-10115606-B2 · Oct 30, 2018 · US
Forming a stress compensation layer and structures formed thereby
US-2018182697-A1 · Jun 28, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 43 |
| Jayaraman Saikumar | 5 |
| Oka Mihir A | 1 |
| Prack Edward R | 1 |
| Xu Dingying | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 14 |
| G02B6/30 | 11 |
| H10W72/20 | 11 |
| H10W74/15 | 11 |
| G02B6/4249 | 10 |