Ablation method and recipe for wafer level underfill material patterning and removal
US-9786517-B2 · Oct 10, 2017 · US
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Prack Edward R patents
Prack Edward R holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Feb 9, 2016 |
| Latest publication | Oct 10, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Package structure to enhance yield of TMI interconnections
US-9613933-B2 · Apr 4, 2017 · US
Dry-removable protective coatings
US-9472517-B2 · Oct 18, 2016 · US
Organic thin film passivation of metal interconnections
US-9257276-B2 · Feb 9, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Ablation method and recipe for wafer level underfill material patterning and removal
US-9786517-B2 · Oct 10, 2017 · US
Package structure to enhance yield of TMI interconnections
US-9613933-B2 · Apr 4, 2017 · US
Dry-removable protective coatings
US-9472517-B2 · Oct 18, 2016 · US
Organic thin film passivation of metal interconnections
US-9257276-B2 · Feb 9, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/01257 | 3 |
| H10W72/01255 | 3 |
| H01L2224/11849 | 3 |
| H01L24/11 | 3 |
| H10W72/242 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Chemistry & Metallurgy | 1 |