Forming a stress compensation layer and structures formed thereby
US-9929080-B2 · Mar 27, 2018 · US
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Jayaraman Saikumar patents
Jayaraman Saikumar holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | May 3, 2016 |
| Latest publication | Mar 27, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Thermoset polymides for microelectronic applications
US-9646903-B2 · May 9, 2017 · US
Dry-removable protective coatings
US-9472517-B2 · Oct 18, 2016 · US
Integrated WLUF and SOD process
US-9349698-B2 · May 24, 2016 · US
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
US-9330993-B2 · May 3, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Forming a stress compensation layer and structures formed thereby
US-9929080-B2 · Mar 27, 2018 · US
Thermoset polymides for microelectronic applications
US-9646903-B2 · May 9, 2017 · US
Dry-removable protective coatings
US-9472517-B2 · Oct 18, 2016 · US
Integrated WLUF and SOD process
US-9349698-B2 · May 24, 2016 · US
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
US-9330993-B2 · May 3, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |
| Chemistry & Metallurgy | 2 |
| Cross-Sectional Technologies | 1 |