Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus

Patent metadata

Field	Value
Publication number	US-10519558-B2
Application number	US-201815954289-A
Country	US
Kind code	B2
Filing date	Apr 16, 2018
Priority date	Apr 28, 2017
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.

First claim

What is claimed is:

1. Copper sulfate comprising a Fe with a concentration of 0.08 ppm by mass or less.

2. The copper sulfate according to claim 1 , wherein the copper sulfate further comprises any one, any two, any three, any four, or five of the following items (3-1) to (3-5):
(3-1) an in with a concentration of 1.0 ppm by mass or less,
(3-2) a TI with a concentration of 0.05 ppm by mass or less,
(3-3) a Sn with a concentration of 1.0 ppm by mass or less,
(3-4) an Ag with a concentration of 1.0 ppm by mass or less, and
(3-5) an Al with a concentration of 0.2 ppm by mass or less.

3. The copper sulfate according to claim 1 , wherein the copper sulfate further comprises any one, any two, any three, any four, or five of the following items (5-1) to (5-5):
(5-1) an In with a concentration of 0.2 ppm by mass or less,
(5-2) a TI with a concentration of 0.05 ppm by mass or less,
(5-3) a Sn with a concentration of 0.2 ppm by mass or less,
(5-4) an Ag with a concentration of 0.3 ppm by mass or less, and
(5-5) an Al with a concentration of 0.1 ppm by mass or less.

4. The copper sulfate according to claim 1 , wherein the copper sulfate further comprises any one, any two, any three, any four, or five of the following items (7-1) to (7-5):
(7-1) an In with a concentration of 0.2 ppm by mass or less,
(7-2) a TI with a concentration of 0.05 ppm by mass or less,
(7-3) a Sn with a concentration of 0.2 ppm by mass or less,
(7-4) an Ag with a concentration of 0.045 ppm by mass or less, and
(7-5) an Al with a concentration of 0.05 ppm by mass or less.

5. The copper sulfate according to claim 1 , wherein the copper sulfate has a concentration of copper sulfate of between 99.9% by mass or more and 99.999% by mass or less.

6. The copper sulfate according to claim 5 , wherein the copper sulfate has a concentration of copper sulfate of 99.995% by mass or less.

7. The copper sulfate according to claim 1 , wherein the copper sulfate has a concentration of copper sulfate of between 99.9% by mass or more and 99.99% by mass or less and a concentration of metal impurities other than Cu of 30 ppm by mass or less in total.

8. The copper sulfate according to claim 1 , wherein the copper sulfate has a total organic carbon concentration of 10 ppm by mass or less.

9. A copper sulfate solution comprising the copper sulfate according to claim 1 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Nagaura Tomota
• Ishii Masafumi

Classifications

• C01G3/10 Primary

  Sulfates · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• C01P2006/80

  Compositional purity · CPC title

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title