Molybdenum physical vapor deposition target
US-2025290193-A1 · Sep 18, 2025 · US
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Hou Wenting patents
Hou Wenting is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hou Wenting |
| Total patents | 34 |
| First publication | May 25, 2017 |
| Latest publication | Sep 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Ru liner above a barrier layer
US-12387978-B2 · Aug 12, 2025 · US
Low resistivity metal stacks and methods of depositing the same
US-2025140562-A1 · May 1, 2025 · US
Low resistivity metal stacks and methods of depositing the same
US-2025105013-A1 · Mar 27, 2025 · US
Layered Substrate with Ruthenium Layer and Method for Producing
US-2024282709-A1 · Aug 22, 2024 · US
Removable mask layer to reduce overhang during re-sputter process in pvd chambers
US-2024249920-A1 · Jul 25, 2024 · US
Ru Liner above a Barrier Layer
US-2024234204-A9 · Jul 11, 2024 · US
Low resistivity gapfill
US-2024175120-A1 · May 30, 2024 · US
Ru Liner above a Barrier Layer
US-2024136223-A1 · Apr 25, 2024 · US
Integrated pvd tungsten liner and seamless cvd tungsten fill
US-2024087955-A1 · Mar 14, 2024 · US
Recent patents
Latest publications not already listed above.
Methods and devices for subtractive self-alignment
US-11908696-B2 · Feb 20, 2024 · US
Metal cap for contact resistance reduction
US-2024038859-A1 · Feb 1, 2024 · US
Plasma enhanced tungsten nucleation for low resistivity
US-2024006236-A1 · Jan 4, 2024 · US
Apparatus for reducing tungsten resistivity
US-11655534-B2 · May 23, 2023 · US
Silicon-containing layer for bit line resistance reduction
US-11637107-B2 · Apr 25, 2023 · US
Silicon-containing layer for bit line resistance reduction
US-11626410-B2 · Apr 11, 2023 · US
Silicon-Containing Layer for Bit Line Resistance Reduction
US-2022406788-A1 · Dec 22, 2022 · US
Silicon-Containing Layer for Bit Line Resistance Reduction
US-2022406790-A1 · Dec 22, 2022 · US
Apparatus for reducing tungsten resitivity
US-2022341025-A1 · Oct 27, 2022 · US
Methods and apparatus for reducing tungsten resistivity
US-11447857-B2 · Sep 20, 2022 · US
Metal cap for contact resistance reduction
US-2022231137-A1 · Jul 21, 2022 · US
Methods and devices for subtractive self-alignment
US-2022130676-A1 · Apr 28, 2022 · US
Methods and apparatus for reducing tungsten resitivity
US-2022081756-A1 · Mar 17, 2022 · US
Methods and devices for subtractive self-alignment
US-11257677-B2 · Feb 22, 2022 · US
Methods and devices for subtractive self-alignment
US-2021233770-A1 · Jul 29, 2021 · US
Method and apparatus for low resistance contact interconnection
US-2021123139-A1 · Apr 29, 2021 · US
Methods and apparatus for filling a feature disposed in a substrate
US-10950500-B2 · Mar 16, 2021 · US
Cap Layer For Bit Line Resistance Reduction
US-2020235104-A1 · Jul 23, 2020 · US
Cap layer for bit line resistance reduction
US-10700072-B2 · Jun 30, 2020 · US
Cap Layer For Bit Line Resistance Reduction
US-2020126996-A1 · Apr 23, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 34 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/44 | 14 |
| C23C14/14 | 12 |
| H10W20/045 | 11 |
| H10P14/418 | 10 |
| H01L21/76876 | 9 |