Applying a solderable surface to conductive ink
US-12457693-B2 · Oct 28, 2025 · US
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Hoffmeyer Mark K patents
Hoffmeyer Mark K is listed as an inventor on 83 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hoffmeyer Mark K |
| Total patents | 83 |
| First publication | Feb 12, 2015 |
| Latest publication | Oct 28, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Standoff and support structures for reliable land grid array and hybrid land grid array interconnects
US-12439542-B2 · Oct 7, 2025 · US
Liquid metal infiltration rework of electronic assembly
US-12016127-B2 · Jun 18, 2024 · US
Low-current voltage source watchdog
US-2024097292-A1 · Mar 21, 2024 · US
Applying a solderable surface to conductive ink
US-2024057266-A1 · Feb 15, 2024 · US
Standoff And Support Structures for Reliable Land Grid Array and Hybrid Land Grid Array Interconnects
US-2024008208-A1 · Jan 4, 2024 · US
Liquid metal infiltration rework of electronic assembly
US-2023371221-A1 · Nov 16, 2023 · US
Applying a solderable surface to conductive ink
US-11805603-B2 · Oct 31, 2023 · US
Reliability enhancement of press fit connectors
US-11784424-B2 · Oct 10, 2023 · US
Pierced thermal interface constructions
US-11774190-B2 · Oct 3, 2023 · US
Recent patents
Latest publications not already listed above.
Liquid metal infiltration rework of electronic assembly
US-11751369-B2 · Sep 5, 2023 · US
Thermal interface material structures for directing heat in a three-dimensional space
US-11703922-B2 · Jul 18, 2023 · US
Integrated circuit module with a structurally balanced package using a bottom side interposer
US-11664302-B2 · May 30, 2023 · US
Reliability enhancement of press fit connectors
US-2023015176-A1 · Jan 19, 2023 · US
Thermal interface material structures for directing heat in a three-dimensional space
US-2022334625-A1 · Oct 20, 2022 · US
Reliability enhancement of press fit connectors
US-11456548-B2 · Sep 27, 2022 · US
Thermal interface material structures for directing heat in a three-dimensional space
US-11416045-B2 · Aug 16, 2022 · US
Fixture facilitating heat sink fabrication
US-11404287-B2 · Aug 2, 2022 · US
Liquid metal infiltration rework of electronic assembly
US-2022232746-A1 · Jul 21, 2022 · US
Liquid metal infiltration rework of electronic assembly
US-11310950-B2 · Apr 19, 2022 · US
Land grid array electrical contact coating
US-11289836-B2 · Mar 29, 2022 · US
Liquid metal infiltration rework of electronic assembly
US-11278977-B2 · Mar 22, 2022 · US
Land grid array electrical contact coating
US-2022029326-A1 · Jan 27, 2022 · US
Connecting a component to a substrate by adhesion to an oxidized solder surface
US-11228124-B1 · Jan 18, 2022 · US
Thermal interface materials with radiative coupling heat transfer
US-11198807-B2 · Dec 14, 2021 · US
Integrated circuit module with a structurally balanced package using a bottom side interposer
US-11195789-B2 · Dec 7, 2021 · US
Pierced thermal interface constructions
US-2021318077-A1 · Oct 14, 2021 · US
Thermal interface material structures for directing heat in a three-dimensional space
US-2021318734-A1 · Oct 14, 2021 · US
Tamper-respondent sensors with liquid crystal polymer layers
US-11122682-B2 · Sep 14, 2021 · US
Multi layer thermal interface material
US-11037860-B2 · Jun 15, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 82 |
| Globalfoundries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/25 | 21 |
| H05K1/181 | 18 |
| H10W40/70 | 17 |
| H01R12/585 | 14 |
| H10W40/22 | 13 |