Applying a solderable surface to conductive ink

Patent metadata

Field	Value
Publication number	US-12457693-B2
Application number	US-202318494187-A
Country	US
Kind code	B2
Filing date	Oct 25, 2023
Priority date	Jun 24, 2019
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.

First claim

What is claimed is:

1 . A method for applying a solderable surface to conductive ink, comprising:
partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste, wherein the conductive paste is uncured and includes a solvent and conductive particles; applying, prior to curing the partially cured conductive ink trace and the conductive paste, a magnetic field to the conductive paste to align the conductive particles in the conductive paste; and curing the partially cured conductive ink trace and the conductive paste.

2 . The method of claim 1 , further comprising washing the cured conductive ink trace and the cured conductive paste.

3 . The method of claim 1 , wherein the conductive particles comprise a ferromagnetic metal core coated in a conductive metal.

4 . The method of claim 1 , wherein the conductive ink trace and the conductive paste comprise a same solvent.

5 . The method of claim 1 , wherein the conductive particles comprise at least one of platelet particles or elongate particles.

6 . The method of claim 1 , further comprising bonding a conductor to the cured conductive paste.

7 . The method of claim 1 , wherein the conductive paste comprises a first portion of conductive paste, and the method further comprises applying a second portion of conductive paste to the conductive ink trace.

8 . The method of claim 7 , wherein the first portion of conductive paste and the second portion of conductive paste comprise conductive particles of different materials.

9 . The method of claim 1 , wherein the magnetic field is applied to the conductive paste at a forty five degree angle relative to a substrate to which the conductive ink trace is applied.

Assignees

• IBM

Inventors

• Hoffmeyer Mark K
• Singh Prabjit

Classifications

• H05K2201/035

  Paste overlayer, i.e. conductive paste or solder paste over conductive layer · CPC title

• H05K3/245

  Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques · CPC title

• H05K2203/043

  Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste · CPC title

• H05K2203/104

  Using magnetic force, e.g. to align particles or for a temporary connection during processing · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title