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Connecting a component to a substrate by adhesion to an oxidized solder surface
US11228124B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-11228124-B1 |
| Application number | US-202117140534-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jan 4, 2021 |
| Priority date | Jan 4, 2021 |
| Publication date | Jan 18, 2022 |
| Grant date | Jan 18, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for connecting a component to a substrate, the component comprising a cable connector component, by adhesion to an oxidized solder surface, comprising: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; and adhering the component to an oxidized surface of a solder portion applied to the substrate, wherein the solder portion applied to the substrate has a melting point lower than one or more other solder portions on the substrate. 2. The method of claim 1 , further comprising oxidizing a surface of the solder portion to create the oxidized surface. 3. The method of claim 1 , further comprising: heating the one or more conductive solder connections and the solder portion applied to the substrate; and separating the component from the substrate. 4. The method of claim 1 , wherein adhering the component to the oxidized surface comprises underfilling an adhesive between the oxidized surface and the component. 5. The method of claim 1 , wherein the solder portion of the substrate is applied to a non-surface-mount-defined copper feature of the substrate. 6. The method of claim 1 , wherein the solder portion of the substrate is applied to a grounded copper feature of the substrate. 7. An apparatus, comprising: a substrate; and a component comprising a cable connector component and coupled to the substrate by: one or more conductive solder connections between the component and one or more conductive portions of the substrate; and an adhesive connection between the component and an oxidized surface of a solder portion applied to the substrate, wherein the solder portion applied to the substrate has a melting point lower than one or more other solder portions on the substrate. 8. The apparatus of claim 7 , wherein the adhesive connection comprises an underfilled adhesive connection between the oxidized surface and the component. 9. The apparatus of claim 7 , wherein the solder portion of the substrate is applied to a non-surface-mount-defined copper feature of the substrate. 10. The apparatus of claim 7 , wherein the solder portion of the substrate is applied to a grounded copper feature of the substrate. 11. A system, comprising: an apparatus comprising: a substrate; and a component comprising a cable connector component and coupled to the substrate by: one or more conductive solder connections between the component and one or more conductive portions of the substrate; and an adhesive connection between the component and an oxidized surface of a solder portion applied to the substrate, wherein the solder portion applied to the substrate has a melting point lower than one or more other solder portions on the substrate. 12. The system of claim 11 , wherein the adhesive connection comprises an underfilled adhesive connection between the oxidized surface and the component. 13. The system of claim 11 , wherein the solder portion of the substrate is applied to a non-surface-mount-defined copper feature of the substrate. 14. The system of claim 11 , wherein the solder portion of the substrate is applied to a grounded copper feature of the substrate.
Assignees
Inventors
Classifications
Manufacturing or production processes characterised by the final manufactured product · CPC title
Removing, replacing or disconnecting component; Easily removable component · CPC title
Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support · CPC title
Non-printed connector · CPC title
Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components · CPC title
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Frequently asked questions
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- What does patent US11228124B1 cover?
- In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K3/225. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).