Thermal interface material structures for directing heat in a three-dimensional space

US11416045B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11416045-B2
Application numberUS-202016847144-A
CountryUS
Kind codeB2
Filing dateApr 13, 2020
Priority dateApr 13, 2020
Publication dateAug 16, 2022
Grant dateAug 16, 2022

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: placing a thermal interface material (TIM) sheet between an upper forming tool and a lower forming tool; and pressing the upper forming tool to the lower forming tool creating a first fold and a second fold in the TIM sheet, wherein the first fold is between a lower portion of the TIM sheet and a first side portion of the TIM sheet, wherein the first fold positions the first side portion of the TIM sheet substantially perpendicular to the lower portion of the TIM sheet, wherein the second fold is between the first side portion of the TIM sheet and a first upper portion of the TIM sheet, wherein the second fold positions the first upper portion of the TIM sheet substantially perpendicular to the first side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet, and wherein pressing the upper forming tool to the lower forming tool does not compress the lower portion of the TIM sheet. 2. The method of claim 1 , wherein pressing the upper forming tool to the lower forming tool compresses the upper portion of the TIM sheet without compressing the lower portion of the TIM sheet. 3. The method of claim 1 , wherein pressing the upper forming tool to the lower forming tool further creates a third fold and a fourth fold in the TIM sheet, wherein the third fold is between the lower portion of the TIM sheet and a second side portion of the TIM sheet, wherein the third fold positions the second side portion of the TIM sheet substantially perpendicular to the lower portion of the TIM sheet, wherein the fourth fold is between the second side portion of the TIM sheet and a second upper portion of the TIM sheet, and wherein the fourth fold positions the second upper portion of the TIM sheet substantially perpendicular to the second side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet. 4. The method of claim 1 , wherein pressing the upper forming tool to the lower forming tool creates additional folds creating adjacent layers of the TIM sheet adjacent and substantially parallel to the first upper portion. 5. The method of claim 1 , further comprising rolling the first upper portion into a coil. 6. The method of claim 1 , further comprising, prior to pressing the upper forming tool to the lower forming tool: scoring the TIM sheet between the lower portion of the TIM sheet and the first side portion of the TIM sheet; and scoring the TIM sheet between the first side portion of the TIM sheet and the first upper portion of the TIM sheet.

Assignees

Inventors

Classifications

  • by flowing liquids, e.g. forced water cooling · CPC title

  • Auxiliary members characterised by their shape · CPC title

  • Bolts or screws · CPC title

  • Organics · CPC title

  • H10W40/25Primary

    characterised by their materials · CPC title

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Frequently asked questions

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What does patent US11416045B2 cover?
A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular t…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10W40/25. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).