Multi layer thermal interface material

Patent metadata

Field	Value
Publication number	US-11037860-B2
Application number	US-201916454370-A
Country	US
Kind code	B2
Filing date	Jun 27, 2019
Priority date	Jun 27, 2019
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

First claim

What is claimed is:

1. A multi-layer thermal interface material comprising:
two or more thermal interface materials laminated together, wherein each of the two or more thermal interface materials comprise different mechanical properties,
wherein the two or more thermal interface materials of the multi-layer thermal interface material are each selected from a group consisting of polymeric elastomer materials, expanded graphite materials, carbon nanotube materials, flexible graphite materials and phase change materials.

2. The multi-layer thermal interface material according to claim 1 , further comprising:
an adhesion layer between the two or more thermal interface materials of the multi-layer thermal interface material, wherein the adhesion layer comprises silicone oil, hydrocarbon oil, thermal grease, or thermal gel.

3. The multi-layer thermal interface material according to claim 1 , wherein one of the thermal interface materials comprises phase change material.

4. The multi-layer thermal interface material according to claim 1 , wherein one of the two or more thermal interface materials has a larger surface area than another one of the two or more thermal interface materials.

5. The multi-layer thermal interface material according to claim 1 , further comprising:
an opening in one of the two or more thermal interface materials.

6. A structure comprising:
a heat sink mounted above a semiconductor component and physically connected to a substrate; and
a multi-layer thermal interface material sandwiched between the heat sink and the semiconductor component, one layer of the multi-layer thermal interface material comprises a first layer comprising a first thermal interface material laminated to a bottom surface of a second layer comprising a second thermal interface material, wherein the first layer comprises an expanded graphite material and the second layer comprises a polymer elastomer material.

7. The structure according to claim 6 , further comprising:
an adhesion layer between the first layer and the second layer, wherein the adhesion layer comprises silicone oil, hydrocarbon oil, thermal grease, or thermal gel.

8. The structure according to claim 6 , wherein lateral dimensions of the first layer are greater than lateral dimensions of the second layer.

9. The structure according to claim 6 , further comprising:
an opening in the first layer.

10. A multi-layer thermal interface material comprising:
two or more thermal interface materials laminated together, wherein each of the two or more thermal interface materials comprise different mechanical properties,
wherein one of the thermal interface materials comprises an expanded graphite material and another thermal interface material comprises a polymer elastomer material.

11. The multi-layer thermal interface material according to claim 10 , further comprising:
an adhesion layer between the two or more thermal interface materials of the multi-layer thermal interface material, wherein the adhesion layer comprises silicone oil, hydrocarbon oil, thermal grease, or thermal gel.

12. The multi-layer thermal interface material according to claim 10 , wherein one of the two or more thermal interface materials has a larger surface area than another one of the two or more thermal interface materials.

13. The structure according to claim 10 , further comprising:
an opening in one of the two or more thermal interface materials.

14. A multi-layer thermal interface material comprising:
two or more thermal interface materials laminated together, wherein each of the two or more thermal interface materials comprise different mechanical properties,
wherein one of the thermal interface materials comprises a flexible graphite material and another thermal interface material comprises a polymer elastomer material.

15. The multi-layer thermal interface material according to claim 14 , further comprising:
an adhesion layer between the two or more thermal interface materials of the multi-layer thermal interface material, wherein the adhesion layer comprises silicone oil, hydrocarbon oil, thermal grease, or thermal gel.

16. The multi-layer thermal interface material according to claim 14 , wherein one of the two or more thermal interface materials has a larger surface area than another one of the two or more thermal interface materials.

17. The structure according to claim 14 , further comprising:
an opening in one of the two or more thermal interface materials.

18. A structure comprising:
a heat sink mounted above a semiconductor component and physically connected to a substrate; and
a multi-layer thermal interface material sandwiched between the heat sink and the semiconductor component, one layer of the multi-layer thermal interface material comprises a first layer comprising a first thermal interface material laminated to a bottom surface of a second layer comprising a second thermal interface material, wherein the first layer comprises a flexible graphite material and the second layer comprises a polymer elastomer material.

19. The multi-layer thermal interface material according to claim 18 , further comprising:
an adhesion layer between the first layer and the second layer, wherein the adhesion layer comprises silicone oil, hydrocarbon oil, thermal grease, or thermal gel.

20. The multi-layer thermal interface material according to claim 18 , wherein lateral dimensions of the first layer are greater than lateral dimensions of the second layer.

21. The structure according to claim 18 , further comprising:
an opening in the first layer.

Assignees

• IBM

Inventors

• Hoffmeyer Mark K
• Campbell Eric J
• Mann Phillip V
• Czaplewski-Campbell Sarah K

Classifications

• H10W72/07355

  changes in materials · CPC title

• H10W72/07353

  changes in shapes · CPC title

• H10W72/357

  Multiple die-attach connectors having different materials · CPC title

• H10W72/337

  Multiple die-attach connectors having different shapes · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title