Molded fluidic die assemblies
US-2023104463-A1 · Apr 6, 2023 · US
This page is not indexed by search engines while we improve data quality.
Hoffman Randy patents
Hoffman Randy is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hoffman Randy |
| Total patents | 12 |
| First publication | Mar 3, 2015 |
| Latest publication | Apr 6, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Conductive elements electrically coupled to fluidic dies
US-11433670-B2 · Sep 6, 2022 · US
Fluidic dies with conductive members
US-11279130-B2 · Mar 22, 2022 · US
Conductive elements electrically coupled to fluidic dies
US-2021252858-A1 · Aug 19, 2021 · US
Fluidic dies with conductive members
US-2021229440-A1 · Jul 29, 2021 · US
Printed circuit board with recessed pocket for fluid droplet ejection die
US-10328694-B2 · Jun 25, 2019 · US
Printed circuit board with recessed pocket for fluid droplet ejection die
US-2018170050-A1 · Jun 21, 2018 · US
Processor-based self-service terminals used with respect to controlled environment facilities
US-9965746-B1 · May 8, 2018 · US
Film stack including adhesive layer
US-9636902-B2 · May 2, 2017 · US
Film stack including adhesive layer
US-9352532-B2 · May 31, 2016 · US
Recent patents
Latest publications not already listed above.
Driving a display
US-2015332637-A1 · Nov 19, 2015 · US
Semiconductor film composition
US-8969865-B2 · Mar 3, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hewlett Packard Development Co | 11 |
| Hewlett Packard Development Co Lp | 2 |
| Hoffman Randy | 2 |
| Keiser Luke | 1 |
| Cooper Bruce | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B41J2/1623 | 8 |
| B41J2/1637 | 5 |
| B41J2/14145 | 4 |
| B41J2002/14491 | 4 |
| B41J2/14072 | 4 |