Conductive elements electrically coupled to fluidic dies

Patent metadata

Field	Value
Publication number	US-11433670-B2
Application number	US-201916958607-A
Country	US
Kind code	B2
Filing date	Apr 29, 2019
Priority date	Apr 29, 2019
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.

First claim

What is claimed is:

1. A fluidic device comprising:
a fluidic die;
a support element coupled to the fluidic die, wherein the fluidic die is secured directly to the support element;
a fluid channel within the support element and defining a fluid path through the support element and a fluid aperture of the fluidic die; and
a conductive element arranged in the fluid path, the conductive element electrically coupled to a ground of the fluidic die, and a material and size of the conductive element to engender galvanic effect at an approximately zero potential, wherein the conductive element comprises a metal or metalloid.

2. The fluidic device of claim 1 further comprising a substrate coupled to the support element, the substrate comprising conductive leads embedded therein.

3. The fluidic device of claim 2 , wherein the embedded conductive leads comprise a ground lead to enable the electric coupling between the ground of the fluidic die and the conductive element.

4. The fluidic device of claim 3 further comprising a chip package comprising a printed circuit board (PCB), molded interconnect device, or molded lead frame device coupled to the substrate, and comprising a ground connected to the ground lead.

5. The fluidic device of claim 1 , wherein the conductive element is arranged to be out of direct physical contact with the fluidic die.

6. A fluidic device comprising:
a fluidic die comprising a fluid aperture;
a support element coupled to the fluidic die and comprising a fluid channel corresponding to the fluid aperture to define a fluid path through the support element and the fluidic die, and embedded conductive leads, wherein the fluidic die is secured directly to the support element; and
a conductive element arranged with respect to the fluidic die and the support element such that a surface of the conductive element is arranged in the fluid channel, and further wherein the conductive element is electrically coupled via the embedded conductive leads to a ground of the fluidic die, and wherein the conductive element comprises a metal or metalloid.

7. The fluidic device of claim 6 , a ratio of a surface area of the surface of the conductive element arranged in the fluid channel to a surface area of the fluidic die exposed in the fluid path is approximately 1:1 to 3:1.

8. The fluidic device of claim 6 , wherein the conductive element comprises Au.

9. The fluidic device of claim 6 further comprising additional fluidic dies comprising additional fluid apertures, the support element comprising additional fluid channels, and wherein the additional fluid apertures and the additional fluid channels define additional fluid paths,
the fluidic device further comprising additional conductive elements corresponding to the additional fluid paths.

10. The fluidic device of claim 9 , wherein the embedded conductive leads provide an electrical coupling between a ground of the additional fluidic dies and the additional conductive elements.

11. The fluidic device of claim 6 , wherein the fluidic die and the conductive element are arranged such that a structural element, an adhesive, a gap, or a combination thereof, provide a physical separation between the fluidic die and the conductive element.

12. The fluidic device of claim 6 , wherein the fluidic die and the conductive element are to form an electrochemical cell while in contact with an electrolyte.

13. A method of making a fluidic device, the method comprising:
embedding conductive leads within a substrate;
connecting an epoxy support member to the substrate, the epoxy support member comprising fluid channels, conductive elements arranged within the fluid channels; and
connecting fluidic dies to the epoxy support member to define fluid paths through the fluid channels and apertures of the fluidic dies, the conductive elements electrically coupled to a common ground with the fluidic dies, wherein the conductive elements comprise a metal or metalloid, and wherein the fluidic dies are secured directly to the epoxy support element.

14. The method of claim 13 , wherein the materials of the fluidic dies and the conductive elements are selected to grow a protective layer on a portion of the fluid paths in response to application of a zero potential.

15. The method of claim 14 , wherein the protective layer is to be grown in response to a contact between an electrolyte with the conductive elements and the fluidic dies.

Assignees

• Hewlett Packard Development Co

Inventors

• Cumbie Michael W
• Chen Chien-Hua
• Hoffman Randy

Classifications

• B41J2/162

  Manufacturing of the nozzle plates · CPC title

• C23F13/08

  Electrodes specially adapted for inhibiting corrosion by cathodic protection; Manufacture thereof; Conducting electric current thereto · CPC title

• C23F13/005

  Anodic protection · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2/1623

  bonding and adhesion · CPC title