Printed circuit board with recessed pocket for fluid droplet ejection die

Patent metadata

Field	Value
Publication number	US-10328694-B2
Application number	US-201515556871-A
Country	US
Kind code	B2
Filing date	Jul 31, 2015
Priority date	Jul 31, 2015
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.

First claim

What is claimed is:

1. An apparatus comprising:
a printed circuit board comprising a recessed pocket; and
a fluid droplet ejection die within the recessed pocket, wherein the printed circuit, board comprises:
a first core layer;
first electrically conductive traces on the first core layer;
a second core layer;

second electrically conductive traces on the second core layer; and
a binding layer joining the first core layer to the second, core layer.

2. The apparatus of claim 1 , wherein the recessed pocket extends into a face of the printed circuit board and wherein the fluid droplet ejection die has a face substantially flush with the face of the printed circuit board.

3. The apparatus of claim 1 , wherein the recessed pocket extends into a face of the printed circuit board that faces in a first direction and wherein the fluid droplet ejection die has a face facing in the first direction and recessed within the recessed pocket.

4. The apparatus of claim 1 further comprising a second fluid droplet ejection die within the recessed pocket.

5. The apparatus of claim 1 , wherein the printed circuit board comprises a second recessed pocket having a second floor, the apparatus further comprising a second fluid droplet ejection die supported within the second recessed pocket.

6. The apparatus of claim 1 , wherein the recessed pocket has a depth of at least 150 μm.

7. The apparatus of claim 1 , wherein the recessed pocket extends into a first face of the printed circuit board and wherein the printed circuit board further comprises a fluid passage extending into a second face of the printed circuit board, the fluid passage being connected to slots of the fluid droplet ejection die.

8. The apparatus of claim 1 further comprising a processing chip supported by the printed circuit board that is connected to transistor arrays to drive the transistor arrays.

9. The apparatus of claim 1 , wherein the recessed pocket has a floor with an electrical contact pad directly on the floor within the pocket, the electrical contact pad being electrically connected to the fluid droplet ejection die.

10. A printed circuit board for use with a fluid droplet ejection die having a thickness, the printed circuit board comprising:
a recessed pocket having a floor and sized to receive the fluid droplet ejection die and having a depth greater than or equal to 150 micrometers; and
an electrical contact pad on the floor, wherein the contact pad is exposed within the recessed pocket.

11. The printed circuit board of claim 10 , wherein the printed circuit board comprises:
a first core layer;
first electrically conductive traces on the first core layer;
a second core layer;
second electrically conductive traces on the second core layer; and
a binding layer joining the first core layer to the second core layer.

Assignees

• Hewlett Packard Development Co

Inventors

• Chen Chien Hua
• Hammerstad Diane R
• Hoffman Randy

Classifications

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/1637

  molding · CPC title

• B41J2/1433

  Structure of nozzle plates · CPC title

• B41J2202/18

  Electrical connection established using vias · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title