Fluidic dies with conductive members

Patent metadata

Field	Value
Publication number	US-11279130-B2
Application number	US-201916958578-A
Country	US
Kind code	B2
Filing date	Apr 29, 2019
Priority date	Apr 29, 2019
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

First claim

The invention claimed is:

1. A fluidic device comprising:
a fluidic die with a back surface;
a support element coupled to the fluidic die, the support element having a fluid channel formed therein, the fluid channel exposing at least a portion of the back surface of the fluidic die, the support element further having a member opening passing through the support element; and
a conductive member connected to the fluidic die, the conductive member at least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element, wherein the conductive member is distanced from the fluidic die.

2. The fluidic device of claim 1 , wherein the fluidic die includes a plurality of fluid ports formed through the back surface thereof such that the fluid channel of the support element is fluidically coupled to the fluid ports of the fluidic die, the fluidic device further comprising:
a cartridge housing coupled to the support element, the cartridge housing having a fluid reservoir disposed therein, the fluid reservoir fluidically connected to the fluid ports of the fluidic die via the fluid channel of the support element.

3. The fluidic device of claim 1 , wherein the conductive member is electrically connected to a common ground with the fluidic die.

4. The fluidic device of claim 3 , wherein the conductive member is to form an electrochemical cell with the fluidic die when in contact with fluid of the fluid channel.

5. The fluidic device of claim 1 , wherein the back surface of the fluidic die has a first surface area that is exposed to the fluid channel, the conductive member has a second surface area that is exposed to the fluid channel, and the second surface area is greater than the first surface area.

6. The fluidic device of claim 1 , wherein the fluidic die comprises a silicon substrate.

7. The fluidic device of claim 1 , wherein the fluidic die includes at least one sensor element disposed on the back surface thereof.

8. The fluidic device of claim 1 , wherein the fluidic die further includes:
a plurality of fluid ports formed through the back surface thereof, the plurality of fluid ports fluidically coupled to the fluid channel of the support element;
a plurality of fluid chambers formed in the fluidic die, the fluid chambers fluidically coupled to the fluid ports;
a plurality of nozzles formed through a top surface thereof, the plurality of nozzles fluidically coupled to the fluid chambers; and
a plurality of fluid actuators, the plurality of fluid actuators disposed in the plurality of fluid chambers.

9. The fluidic device of claim 1 , further comprising:
a conductive adhesive that adheres the conductive member to the support element and connects the conductive member to the fluidic die.

10. A fluidic device comprising:
a cartridge housing having a fluid channel formed therein, the cartridge housing further having a member opening passing therethrough;
a fluidic die coupled to the cartridge housing, the fluidic die having a plurality of fluid ports formed in a back surface thereof, at least a portion of the back surface of the fluidic die exposed to the fluid channel such that the fluid channel is fluidically coupled to the fluid ports;
a fluid reservoir disposed within the housing and fluidically coupled to the fluid channel such that the fluid reservoir supplies fluid to the fluidic die via the fluid channel and the fluid ports; and
a conductive member electrically connected to the fluidic die and at least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel, wherein the conductive member is distanced from the fluidic die.

11. The fluidic device of claim 10 , wherein the conductive member is electrically connected to a common ground with the fluidic die such that the conductive member, fluidic die, and fluid of the fluid channel form an electrochemical cell.

12. The fluidic device of claim 10 , wherein the conductive member is formed of a core formed of a first material and an outer layer formed of a second material.

13. The fluidic device of claim 10 , wherein the fluidic die further comprises:
a plurality of fluid chambers formed in the fluidic die, the fluid chambers fluidically coupled to the fluid ports;
a plurality of nozzles formed through a top surface thereof, the plurality of nozzles fluidically coupled to the fluid chambers; and
a plurality of fluid actuators, the plurality of fluid actuators disposed in the plurality of fluid chambers.

14. A fluidic device comprising:
a plurality of fluidic dies;
a support element coupled to the plurality of fluidic dies, the support element having at least one fluid channel formed therein, the at least one fluid channel exposing at least a portion of a back surface of each fluidic die of the plurality of fluidic dies, the support element having at least one member opening formed therethrough; and
at least one conductive member coupled to the support element and passing through the at least one member opening such that at least a portion of the at least one conductive member is exposed to the at least one fluid channel, the at least one conductive member connected to the plurality of fluidic dies, wherein the at least one conductive member is distanced from the plurality of fluidic dies.

15. The fluidic device of claim 14 , wherein each fluidic die of the plurality comprises a silicon substrate, the at least one conductive member is connected to a common ground with each fluidic die such that the at least one conductive member and the plurality of fluidic dies are to form an electrochemical cell when in contact with fluid of the fluid channel.

Assignees

• Hewlett Packard Development Co

Inventors

• Cumbie Michael W
• Benson David J
• Hoffman Randy
• Gault Amy

Classifications

• B41J2/1637

  molding · CPC title

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/1632

  machining · CPC title

• B41J2/14024

  Assembling head parts · CPC title

• B41J2/14145 Primary

  Structure of the manifold · CPC title