Wafer scale active thermal interposer for device testing
US-12540967-B2 · Feb 3, 2026 · US
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Hiroki Ikeda patents
Hiroki Ikeda is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hiroki Ikeda |
| Total patents | 12 |
| First publication | May 19, 2022 |
| Latest publication | Feb 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer scale active thermal interposer for device testing
US-12540968-B2 · Feb 3, 2026 · US
Wafer scale active thermal interposer for device testing
US-12535522-B2 · Jan 27, 2026 · US
Wafer scale active thermal interposer for device testing
US-2025271496-A1 · Aug 28, 2025 · US
Wafer scale active thermal interposer for device testing
US-2025271497-A1 · Aug 28, 2025 · US
Wafer scale active thermal interposer for device testing
US-2025264525-A1 · Aug 21, 2025 · US
Wafer scale active thermal interposer for device testing
US-12320841-B2 · Jun 3, 2025 · US
Wafer scale active thermal interposer for device testing
US-2025130276-A1 · Apr 24, 2025 · US
Wafer scale active thermal interposer with thermal isolation structures
US-2024183897-A1 · Jun 6, 2024 · US
Active thermal interposer device with thermal isolation structures
US-2024183898-A1 · Jun 6, 2024 · US
Recent patents
Latest publications not already listed above.
Thermal solution for massively parallel testing
US-11940487-B2 · Mar 26, 2024 · US
Wafer scale active thermal interposer for device testing
US-2022155364-A1 · May 19, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advantest Test Solutions Inc | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01R31/2875 | 12 |
| G01R31/2877 | 11 |
| G01R31/2874 | 11 |
| G01R31/2889 | 10 |
| G01R31/2856 | 10 |