Hybrid-bonded ic die having topographic surface features
US-2026099012-A1 · Apr 9, 2026 · US
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Heck John patents
Heck John is listed as an inventor on 78 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Heck John |
| Total patents | 78 |
| First publication | Mar 3, 2015 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Hybrid iii-v silicon optical devices with oxide-based current confinement
US-2026095026-A1 · Apr 2, 2026 · US
Hybrid laser with amorphous bonding layer
US-12548973-B2 · Feb 10, 2026 · US
Multi-layer silicon photonics apparatus
US-12529847-B2 · Jan 20, 2026 · US
Photonic integrated circuit to glass substrate alignment through integrated cylindrical lens and waveguide structure
US-12523826-B2 · Jan 13, 2026 · US
Photonic integrated circuit to glass substrate alignment through dual cylindrical lens
US-12523827-B2 · Jan 13, 2026 · US
Heating of thermo-optic device
US-12461396-B2 · Nov 4, 2025 · US
Silicon photonic integrated circuits with enhanced thermal isolation of heater elements
US-2025306405-A1 · Oct 2, 2025 · US
Silicon photonic integrated circuits with localized thick buried insulator
US-2025216601-A1 · Jul 3, 2025 · US
V-groove fiber stop
US-2025102740-A1 · Mar 27, 2025 · US
Recent patents
Latest publications not already listed above.
Silicon photonic integrated circuits on substrates with structured insulators having specific thicknesses in separate zones
US-12197004-B2 · Jan 14, 2025 · US
Optical coherent receiver on a chip
US-2024388366-A1 · Nov 21, 2024 · US
Multi-layer silicon photonics apparatus
US-2024345319-A1 · Oct 17, 2024 · US
Optical coherent receiver on a chip
US-12081276-B2 · Sep 3, 2024 · US
Embedded three-dimensional electrode capacitor
US-12057386-B2 · Aug 6, 2024 · US
Multi-layer silicon photonics apparatus
US-12019270-B2 · Jun 25, 2024 · US
Integrated optical phase change materials for reconfigurable optics in glass cores
US-2024176167-A1 · May 30, 2024 · US
Vertical through-silicon waveguide fabrication method and topologies
US-2024103216-A1 · Mar 28, 2024 · US
Vertical pn junction photonics modulators with backside contacts and low temperature operation
US-2024103304-A1 · Mar 28, 2024 · US
III-N multichip modules and methods of fabrication
US-11908687-B2 · Feb 20, 2024 · US
Integrated photonic transceiver
US-11906777-B2 · Feb 20, 2024 · US
Silicon photonic integrated lens compatible with wafer processing
US-11894474-B2 · Feb 6, 2024 · US
Hybrid bonding with photonic integrated circuits for high bandwidth reticle stitching of reticle sized integrated circuit dies
US-2024004129-A1 · Jan 4, 2024 · US
Lens with alignment facets
US-2023185022-A1 · Jun 15, 2023 · US
Photonic integrated circuit to glass substrate alignment through integrated cylindrical lens and waveguide structure
US-2023077633-A1 · Mar 16, 2023 · US
Hybrid laser with amorphous bonding layer
US-2023075255-A1 · Mar 9, 2023 · US
Silicon photonic integrated circuits on substrates with structured insulators
US-2022413213-A1 · Dec 29, 2022 · US
Iii-n multichip modules and methods of fabrication
US-2022122842-A1 · Apr 21, 2022 · US
Embedded three-dimensional electrode capacitor
US-2022084936-A1 · Mar 17, 2022 · US
Optical receiver employing a metasurface collection lens having concentric belts or rings
US-11222987-B2 · Jan 11, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 78 |
| Heck John | 9 |
| Rong Haisheng | 7 |
| Jones Richard | 2 |
| Univ California | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B6/12004 | 21 |
| G02B6/136 | 17 |
| G02B6/4214 | 16 |
| G02B6/122 | 15 |
| G02B2006/12061 | 13 |