Silicon photonic integrated circuits on substrates with structured insulators having specific thicknesses in separate zones

Patent metadata

Field	Value
Publication number	US-12197004-B2
Application number	US-202117358912-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Jun 25, 2021
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

Silicon photonic integrated circuit (PIC) on a multi-zone semiconductor on insulator (SOI) substrate having at least a first zone and a second zone. Various optical devices of the PIC may be located above certain substrate zones that are most suitable. A first length of a photonic waveguide structure comprises the crystalline silicon and is within the first zone, while a second length of the waveguide structure is within the second zone. Within a first zone, the crystalline silicon layer is spaced apart from an underlying substrate material by a first thickness of dielectric material. Within the second zone, the crystalline silicon layer is spaced apart from the underlying substrate material by a second thickness of the dielectric material.

First claim

What is claimed is:

1. A photonic integrated circuit (PIC) comprising:
a semiconductor on insulator (SOI) substrate comprising:
a first zone within which a crystalline silicon layer is spaced apart from an underlying substrate material by a first thickness of dielectric material comprising silicon and oxygen; and
a second zone surrounded by the first zone, wherein within the second zone the crystalline silicon layer is spaced apart from the underlying substrate material by a second thickness of the dielectric material that is at least twice the first thickness; and

a photonic waveguide structure on the SOI substrate, wherein a first length of the waveguide structure is within the first zone and comprises the crystalline silicon, and a second length of the waveguide structure is within the second zone.

2. The PIC of claim 1 , wherein the second length of the waveguide structure comprises a compound of silicon and nitrogen, and wherein an interface between the dielectric material and crystalline silicon is coplanar with an interface between the dielectric material and the compound of silicon and nitrogen.

3. The PIC of claim 2 , wherein the waveguide structure further comprises a tapered length between the first length and second length, wherein the tapered length is within the second zone, and wherein the tapered length of the waveguide structure comprises the crystalline silicon.

4. The PIC of claim 3 , wherein the PIC comprises an optical edge coupler and the optical edge coupler comprises the second length of the waveguide structure.

5. The PIC of claim 3 , wherein the PIC comprises an optical multiplexer or optical demultiplexer, and wherein the optical multiplexer or optical demultiplexer comprises the second length of the waveguide structure.

6. The PIC of claim 1 , wherein the second length of the waveguide structure also comprises the crystalline silicon.

7. The PIC of claim 6 , wherein the PIC further comprises a resistive heater element over the second length of the waveguide structure.

8. The PIC of claim 7 , wherein the PIC further comprises an optical modulator, and wherein the optical modulator comprises the second length of the waveguide structure and the resistive heater element.

9. The PIC of claim 1 , wherein:
the SOI substrate further comprises a third zone surrounded by the first zone or the second zone, wherein within the third zone the crystalline silicon layer is spaced apart from the underlying substrate material by a thickness of a heat dissipation material that has a higher thermal conductivity than the dielectric material; and
a third length of the waveguide structure comprises the crystalline silicon and is within the third zone.

10. The PIC of claim 9 , wherein the heat dissipation material comprises at least one of silicon or a metal.

11. The PIC of claim 10 , wherein the heat dissipation material comprises at least one of W, Al or nitrogen.

12. The PIC of claim 11 , wherein the PIC further comprises a laser over the third length of the waveguide.

13. The PIC of claim 1 , further comprising a cladding material over the first and second lengths of the waveguide structure, the cladding material comprising silicon and oxygen, wherein the second zone has an area of at least 100 μm 2 and wherein the second thickness is at least 2 μm.

14. A system, comprising:
a power supply; and
a photonic integrated circuit (PIC) coupled to the power supply, wherein the PIC further comprises:
an optical device comprising a laser, modulator, or de/multiplexer;
optical output coupler; and
a first optical waveguide structure coupling the optical device to the output coupler, wherein:
the first optical waveguide structure comprises crystalline silicon within a first zone of a semiconductor on insulator (SOI) substrate, the first zone comprising the crystalline silicon spaced apart from an underlying substrate material by a first thickness of dielectric material comprising silicon and oxygen; and
the optical device or the output coupler comprises a second optical waveguide structure within a second zone of the SOI substrate, the second zone comprising the crystalline silicon, but spaced apart from the underlying substrate material by a second thickness of the dielectric material that is at least twice the first thickness.

15. The system of claim 14 , wherein the second optical waveguide structure comprises a compound of silicon and nitrogen, and wherein an interface between the dielectric material and crystalline silicon is coplanar with an interface between the dielectric material and the compound of silicon and nitrogen.

16. A method of fabricating a photonic integrated circuit (PIC), the method comprising:
receiving a first substrate;
defining a first and second zone within the first substrate by patterning a recess into the second zone;
depositing a dielectric material over the first and second zones of the first substrate, the dielectric material comprising silicon and oxygen;
planarizing a surface of the dielectric material;
forming a multi-zone semiconductor-on-insulator (SOI) substrate by bonding the surface of the dielectric material to a crystalline silicon layer of a second substrate; and
forming a waveguide structure on the multi-zone SOI substrate, wherein a first length of the waveguide structure is within the first zone and comprises the crystalline silicon layer, and a second length of the waveguide structure is within the second zone.

17. The method of claim 16 , wherein:
the second substrate is an SOI substrate comprising the crystalline silicon layer; and
the method further comprises expose a surface of the crystalline silicon layer opposite the dielectric material by thinning the multi-zone SOI substrate.

18. The method of claim 16 , further comprising depositing a heat dissipating material within the recess, the heat dissipating material having a higher thermal conductivity than the dielectric material.

19. The method of claim 18 , further comprising planarizing the heat dissipating material with a surface of the first zone of the substrate, and depositing the dielectric material over the first and second zones of the first substrate after planarizing the dissipating material.

20. The method of claim 18 , wherein the heat dissipating material comprises at least one of Si, W, Al, or nitrogen.

21. The method of claim 16 , wherein the recess has an area of at least 100 μm 2 and a depth of at least 1 μm.

22. The method of claim 16 , wherein forming the PIC further comprises:
removing a portion of the crystalline silicon from within the second zone;
depositing a compound comprising silicon and nitrogen on the dielectric material; and
patterning the compound into the second waveguide structure.

Assignees

• Intel Corp

Inventors

• Frish Harel
• Heck John
• Appleton Randal
• Meister Stefan
• Rong Haisheng
• Keener Joshua
• Favaro Michael
• Harrison Wesley
• Mahalingam Hari
• Sochava Sergei

Classifications

• G02B6/1225

  comprising photonic band-gap structures or photonic lattices · CPC title

• G02B2006/12061

  Silicon · CPC title

• G02B2006/12164

  Multiplexing; Demultiplexing · CPC title

• G02B2006/1213

  comprising photonic band-gap structures or photonic lattices · CPC title

• H01S5/026

  Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06) · CPC title