Recessed and embedded die coreless package
US-10541232-B2 · Jan 21, 2020 · US
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Guzek John patents
Guzek John is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Guzek John |
| Total patents | 12 |
| First publication | Aug 18, 2015 |
| Latest publication | Jan 21, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Recessed and embedded die coreless package
US-2019081023-A1 · Mar 14, 2019 · US
Recessed and embedded die coreless package
US-10163863-B2 · Dec 25, 2018 · US
Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate
US-9941245-B2 · Apr 10, 2018 · US
Recessed and embedded die coreless package
US-2018012871-A1 · Jan 11, 2018 · US
Panel level fabrication of package substrates with integrated stiffeners
US-9832860-B2 · Nov 28, 2017 · US
Recessed and embedded die coreless package
US-2017125385-A1 · May 4, 2017 · US
Recessed and embedded die coreless package
US-9553075-B2 · Jan 24, 2017 · US
Panel level fabrication of package substrates with integrated stiffeners
US-2016095209-A1 · Mar 31, 2016 · US
Recessed and embedded die coreless package
US-2015357312-A1 · Dec 10, 2015 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 12 |
| Guzek John | 2 |
| Skeete Oswald | 1 |
| Mahajan Ravi | 1 |
| Li Yonggang | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/142 | 9 |
| H10W90/722 | 9 |
| H10W90/00 | 9 |
| H10W70/60 | 9 |
| H10W70/614 | 9 |