Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
US-9648733-B2 · May 9, 2017 · US
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Li Yonggang patents
Li Yonggang holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Apr 7, 2015 |
| Latest publication | May 9, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate
US-9442286-B2 · Sep 13, 2016 · US
Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)
US-9113547-B2 · Aug 18, 2015 · US
Multichip integration with through silicon via (TSV) die embedded in package
US-9000599-B2 · Apr 7, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
US-9648733-B2 · May 9, 2017 · US
Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate
US-9442286-B2 · Sep 13, 2016 · US
Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)
US-9113547-B2 · Aug 18, 2015 · US
Multichip integration with through silicon via (TSV) die embedded in package
US-9000599-B2 · Apr 7, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H05K2201/09563 | 2 |
| H05K2201/0394 | 2 |
| H05K3/0032 | 2 |
| G02B26/10 | 1 |
| B23K2201/42 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Operations & Transport | 2 |
| Physics | 2 |
| Cross-Sectional Technologies | 2 |
| Chemistry & Metallurgy | 1 |