Cold plate with controlled deformation
US-2026101470-A1 · Apr 9, 2026 · US
This page is not indexed by search engines while we improve data quality.
Franz John patents
Franz John is listed as an inventor on 106 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Franz John |
| Total patents | 106 |
| First publication | Oct 27, 2015 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Flexible cold plate assembly
US-2026101471-A1 · Apr 9, 2026 · US
Distributed filtration for liquid cooling
US-2026027495-A1 · Jan 29, 2026 · US
Modules, systems, and methods for cooling optics and copper packages
US-2025311147-A1 · Oct 2, 2025 · US
Conforming heat transport device for dual inline memory module cooling applications
US-12432884-B2 · Sep 30, 2025 · US
Systems and methods for temperature regulation of electronic devices
US-2025244807-A1 · Jul 31, 2025 · US
Receptacle with connectable spring finger for multipoint contact conduction cooling
US-12309969-B2 · May 20, 2025 · US
Disconnects
US-12245401-B2 · Mar 4, 2025 · US
Electrical frequency response fluid analysis
US-12227433-B2 · Feb 18, 2025 · US
Switch sub-chassis systems and methods
US-12105330-B2 · Oct 1, 2024 · US
Recent patents
Latest publications not already listed above.
Conforming heat transport device for dual inline memory module cooling applications
US-2024251528-A1 · Jul 25, 2024 · US
Conforming heat transport device for dual inline memory module cooling applications
US-11974414-B2 · Apr 30, 2024 · US
Photo-etched chassis cooling walls
US-11937407-B2 · Mar 19, 2024 · US
Memory cooler
US-11877422-B2 · Jan 16, 2024 · US
Receptacle with connectable spring finger for multipoint contact conduction cooling
US-2023345668-A1 · Oct 26, 2023 · US
Temperature control of closely packed electronic assemblies
US-11785743-B2 · Oct 10, 2023 · US
Disconnects
US-2023320032-A1 · Oct 5, 2023 · US
Receptacle with connectable spring finger for multipoint contact conduction cooling
US-11729943-B2 · Aug 15, 2023 · US
System for securing a computing system in a host infrastructure
US-11729934-B2 · Aug 15, 2023 · US
Disconnects
US-11711907-B2 · Jul 25, 2023 · US
Leak mitigation system
US-11662126-B2 · May 30, 2023 · US
Memory cooler
US-2023047496-A1 · Feb 16, 2023 · US
Multipoint contact conduction cooling of a removable device
US-11579668-B2 · Feb 14, 2023 · US
Swivel-capable, low-pressure-drop hose barb fittings
US-11536402-B2 · Dec 27, 2022 · US
Leak mitigation system
US-2022404079-A1 · Dec 22, 2022 · US
Temperature control of closely packed electronic assemblies
US-2022369513-A1 · Nov 17, 2022 · US
System for securing a computing system in a host infrastructure
US-2022287196-A1 · Sep 8, 2022 · US
Magnetic blocks for thermally coupling cooling component and heat spreader
US-11417451-B2 · Aug 16, 2022 · US
Receptacle with connectable spring finger for multipoint contact conduction cooling
US-2022240416-A1 · Jul 28, 2022 · US
High connector count mating compliance
US-11381017-B2 · Jul 5, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hewlett Packard Entpr Dev Lp | 99 |
| Hewlett Packard Development Co | 4 |
| Nvidia Corp | 3 |
| Mellanox Technologies Ltd | 2 |
| Hewlett Packard Entpr Patent Department Lp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F1/20 | 44 |
| H05K7/20272 | 33 |
| G06F2200/201 | 29 |
| H05K7/20254 | 21 |
| H05K7/20772 | 19 |