Receptacle with connectable spring finger for multipoint contact conduction cooling

Patent metadata

Field	Value
Publication number	US-12309969-B2
Application number	US-202318345213-A
Country	US
Kind code	B2
Filing date	Jun 30, 2023
Priority date	Jan 22, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

First claim

What is claimed is:

1. An electronic system comprising:
a host device comprising a cooling component;
a removable device comprising a heat spreader, wherein the removable device is detachably connectable to the host device;
a receptacle comprising a plurality of spring fingers, coupled to the heat spreader; and
a heat transfer device comprising a first portion and a second portion, wherein the first portion is coupled to the cooling component, and the second portion is protruded outwards relative to the cooling component, wherein, when the removable device is connected to the host device, the second portion extends through the receptacle such that the plurality of spring fingers establish a direct thermal interface with the second portion and thermally couple the cooling component to the heat spreader to allow a waste-heat to transfer between the heat spreader and the cooling component via the heat transfer device and the receptacle.

2. The electronic system of claim 1 , wherein the heat transfer device comprises one of a heat pipe or a vapor chamber.

3. The electronic system of claim 1 , wherein the cooling component comprises a first recess and the heat spreader comprises a second recess, wherein the receptacle is disposed along the second recess and coupled to the heat spreader, and wherein the first portion of the heat transfer device is disposed along the first recess and coupled to the cooling component.

4. The electronic system of claim 3 , wherein the cooling component is a cold plate, wherein the cold plate comprises a fluid inlet, a fluid outlet, and a plenum fluidically connecting the fluid inlet and the fluid outlet, wherein the plenum is in a thermal communication with the first recess, and wherein a liquid coolant is directed from the fluid inlet to the fluid outlet for dissipating the waste-heat from the cold plate.

5. The electronic system of claim 1 , wherein each spring finger comprises a first end coupled to a frame of the receptacle, a second end having a dry contact surface to establish the direct thermal interface with the heat transfer device, and a body interconnecting the first and second ends, and wherein the plurality of spring fingers are arranged adjacent to one another along a circumferential direction to form an array of spring fingers.

6. The electronic system of claim 1 , wherein each spring finger comprises a first end and a second end coupled to a frame of the receptacle, and a body interconnecting the first and second ends, wherein the body is bent inwardly relative to the frame and includes a dry contact surface to establish the direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to one another along a circumferential direction to form an array of spring fingers.

7. The electronic system of claim 6 , wherein the second end is offset relative to the first end such that the body is disposed at angle relative to the first end.

8. The electronic system of claim 1 , wherein each spring finger comprises a first end, a second end, and a body interconnecting the first and second ends, coupled to a frame of the receptacle, wherein the first and second ends are disposed facing one another, bent inwardly relative to the frame, and has a dry contact surface to establish the direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to one another along a lateral direction to form an array of spring fingers.

9. The electronic system of claim 1 , wherein the host device further comprises a connector rigidly coupled to a housing of the electronic system, and a host circuit board coupled to the connector, wherein the removable device further comprises a circuit board, and wherein the circuit board is communicatively coupled to the host circuit board through the connector when the removable device is connected to the host device.

10. The electronic system of claim 1 , wherein the host device is a switch, and wherein the removable device is a transceiver.

11. An electronic system comprising:
an electronic device for removably coupling with a host device comprising a host circuit board, a connector coupled to the host circuit board, a cooling component, and a heat transfer device, wherein the electronic device comprises:
a circuit board comprising a heat generating component and an electrical connector configured to, in an installed state of the electronic device in the host device, mate with the connector of the host device;
a heat spreader coupled to the heat generating component to dissipate heat generated by the heat generating component; and
a receptacle comprising a plurality of spring fingers coupled to the heat spreader,

wherein the heat transfer device comprises a first portion coupled to the cooling component, and a second portion protruded outwards relative to the cooling component along a direction of insertion of the electronic device into the host device, the second portion protruding beyond the circuit board,
wherein the second portion of the heat transfer device is configured to, in the installed state of the electronic device in the host device, be received within the receptacle such that the plurality of spring fingers establish a direct thermal interface with the second portion and thermally couple the cooling component to the heat spreader to allow the waste-heat to transfer from the heat spreader to the cooling component coupled to the heat transfer device via the receptacle and the first and second portions of the heat transfer device.

12. The electronic system of claim 11 , wherein the heat transfer device comprises one of a heat pipe or a vapor chamber.

13. The electronic system of claim 11 , wherein the cooling component comprises a first recess and the heat spreader comprises a second recess, wherein the receptacle is disposed along the second recess and coupled to the heat spreader, and wherein the first portion of the heat transfer device is disposed along the first recess and coupled to the cooling component.

14. The electronic system of claim 13 , wherein the cooling component is a cold plate, wherein the cold plate comprises a fluid inlet, a fluid outlet, and a plenum fluidically connecting the fluid inlet and the fluid outlet, wherein the plenum is in a thermal communication with the first recess, and wherein a liquid coolant is directed from the fluid inlet to the fluid outlet for dissipating the waste-heat from the cold plate.

15. The electronic system of claim 11 , wherein each spring finger comprises a first end coupled to a frame of the receptacle, a second end having a dry contact surface to establish the direct thermal interface with the heat transfer device, and a body interconnecting the first and second ends, and wherein the plurality of spring fingers are arranged adjacent to one another along a circumferential direction to form an array of spring fingers.

16. The electronic system of claim 11 , wherein each spring finger comprises a first end and a second end coupled to a frame of the receptacle, and a body interconnecting the first and second ends, wherein the body is bent inwardly relative to the frame and includes a dry contact surface to establish the direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to one another along a circumferential direction to form an array of spring fingers.

17. The electronic system of claim 16 , wherein the second end is offset relative to the first end such that the body is disposed at an

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Lunsman Harvey J
• Ferrer Ernesto
• Franz John

Classifications

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20218 Primary

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title