Conforming heat transport device for dual inline memory module cooling applications

Patent metadata

Field	Value
Publication number	US-12432884-B2
Application number	US-202418627195-A
Country	US
Kind code	B2
Filing date	Apr 4, 2024
Priority date	Aug 23, 2019
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

First claim

What is claimed is:

1. A circuit board cooling apparatus comprising:
a heat spreader device configured to be thermally coupled with a surface of a circuit board to be cooled, the heat spreader device having a surface contour;
a heat transport device configured to remove heat from the circuit board; and
a heat transfer device configured to thermally couple the heat spreader device to the heat transport device, wherein the heat transfer device comprises a sheet metal body attached to the heat transport device by wrapping around the heat transport device and configured to directly contact the heat spreader device and conform to the surface contour thereof,
wherein the sheet metal body of the heat transfer device comprises a first portion and a second portion integrally connected with the first portion, the first portion configured to directly contact the heat spreader device and comprising an elastic member configured to be deflected by contact with the heat spreader device and conform to the surface contour thereof, and the second portion attached to, wrapped around, and directly contacting the heat transport device.

2. The circuit board cooling apparatus of claim 1 , wherein the elastic member comprises a plurality of elastic tabs configured to be deflected by contact with the heat spreader device and conform to the surface contour.

3. The circuit board cooling apparatus of claim 1 , further comprising:
a second heat spreader device configured to be thermally coupled with a surface of a second circuit board to be cooled, the second heat spreader device having a second surface contour;
wherein the heat transfer device is configured to thermally couple the second heat spreader device to the heat transport device; and
wherein the metal body of the heat transfer device comprises a third portion integrally connected with the second portion and configured to directly contact the second heat spreader device and conform to the second surface contour thereof.

4. The circuit board cooling apparatus of claim 3 , wherein the first portion comprises a first elastic portion configured to be deflected by contact with the heat spreader device and conform to the surface contour thereof, and the third portion comprises a second elastic portion configured to be deflected by contact with the second heat spreader device and conform to the second surface contour thereof.

5. The circuit board cooling apparatus of claim 1 , wherein the heat transport device is a heat pipe.

6. The circuit board cooling apparatus of claim 1 , wherein the heat transport device has a first side configured to face the heat spreader, a second side opposite from the first side, and a top extending between the first and second sides, and
wherein the second portion directly contacts both the first side and the second side of the heat transport device.

7. A system comprising:
one or more memory boards;
a plurality of memory modules mounted to the one or more memory boards;
a plurality of heat spreader devices thermally coupled with the plurality of memory modules, respectively, each of the heat spreader devices having a surface contour; and
a plurality of heat transfer assemblies each thermally coupled with a corresponding memory module of the plurality of memory modules, wherein each of the heat transfer assemblies comprises:
a heat transport device configured to remove heat from the corresponding memory module; and
a heat transfer device comprising a sheet metal body attached to the heat transport device by wrapping around the heat transport device and conforming to the surface contour of the heat spreader of the corresponding memory module to thermally couple the heat spreader device to the heat transport device, and

wherein each of the memory modules is thermally coupled to at least two of the heat transfer assemblies disposed on opposite sides of the respective memory module.

8. The system of claim 7 , wherein, for each of the heat transfer assemblies, the sheet metal body comprises a first portion and a second portion integrally connected to the first portion, the first portion configured to directly contact the heat spreader device of the corresponding memory module and conform to the surface contour thereof, and the second portion attached to, wrapped around, and directly contacting the heat transport device.

9. The system of claim 8 , wherein the first portion comprises a plurality of elastic tabs configured to be deflected by contact with the heat spreader device and conform to the surface contour.

10. The system of claim 8 , wherein the first portion comprises a single elastic member configured to be deflected by contact with the heat spreader device and conform to the surface contour.

11. The system of claim 8 ,
wherein for each of at least some of the heat transfer assemblies, the heat transfer assembly is thermally coupled with an additional corresponding memory module of the plurality of memory modules, and the sheet metal body of the heat transfer device of the heat transfer assembly comprises a third portion integrally connected to the second portion and configured to directly contact the heat spreader device of the additional corresponding memory module and conform to the surface contour thereof.

12. The system of claim 11 , wherein, for each of the at least some of the heat transfer assemblies, the first portion comprises a first elastic portion configured to be deflected by contact with the heat spreader device of the corresponding memory module and conform to the surface contour thereof, and the third portion comprises a second elastic portion configured to be deflected by contact with the heat spreader device of the additional corresponding memory module and conform to the surface contour thereof.

13. The system of claim 7 , wherein for each of at least some of the heat transfer assemblies: the heat transfer assembly is thermally coupled with an additional corresponding memory module of the plurality of memory modules, and the heat transfer device of the heat transfer assembly conforms to the surface contour of the heat spreader of the additional corresponding memory module.

14. The system of claim 7 ,
wherein the one or more memory boards comprises a first memory board and a second memory board;
wherein the plurality of memory modules comprise a first set of memory modules mounted to the first memory board and a second set of memory module mounted to the second memory board;
wherein the first and second memory boards are disposed opposite one another with the first set of memory modules interleaved with the second set of memory modules; and
wherein, for each pair of adjacent memory modules of the plurality of memory modules, at least one of the heat transfer assemblies is disposed between the pair of adjacent memory modules and is thermally coupled to at least one of the memory modules of the pair.

15. The system of claim 14 ,
wherein, for each of the heat transfer assemblies disposed between one of the pairs of adjacent memory modules, the heat transfer assembly is thermally coupled to both memory modules of the pair.

16. The system of claim 7 ,
wherein, for each of the heat transfer assemblies, the heat transport device comprises a heat pipe and the heat transfer device comprises a sheet metal body comprising an attached portion wrapped at least partially around the heat pipe and a free portion extending from the attached portion and contacting the heat spreader of the corresponding memory module, the free portion being elastically displaced by the heat spreader of the corresponding memory module and co

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Ferrer Medina Ernesto
• Lunsman Harvey J
• Cader Tahir
• Franz John

Classifications

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• G06F1/20

  Cooling means · CPC title

• G11C5/04

  Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports · CPC title

• H05K7/20509 Primary

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G11C7/04 Primary

  with means for avoiding disturbances due to temperature effects · CPC title