Memory cooler

Patent metadata

Field	Value
Publication number	US-11877422-B2
Application number	US-202117399940-A
Country	US
Kind code	B2
Filing date	Aug 11, 2021
Priority date	Aug 11, 2021
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

First claim

What is claimed:

1. A memory cooler, including:
a unitary thermal transfer device including:
a plurality of heat transfer tubes, each heat transfer tube having a first tube end and a second tube end and defining a respective liquid flow channel;
a first end block structurally integrated with each of the heat transfer tubes at a respective first tube end of the at least one heat transfer tube;
a second end block structurally integrated with each of the heat transfer tubes at a respective second tube end;
an inlet chamber partially defined by the second end block, the inlet chamber fluidly coupled with at least one respective liquid flow channel of at least one of the heat transfer tubes;
an inlet to the inlet chamber;
an outlet chamber partially defined by the first end block, the outlet chamber fluidly coupled with at least one respective liquid flow channel of at least one of the heat transfer tubes; and
an outlet from the outlet chamber;
a first endcap, the first endcap affixed to the first end block to define, in conjunction with the first end block, the outlet chamber and at least a first circulation chamber; and
a second endcap, the second endcap affixed to the second end block to define, in conjunction with the second end block, the inlet chamber and at least a second circulation chamber.

2. The memory cooler of claim 1 , wherein the at least one respective liquid flow channel to which the inlet chamber is fluidly coupled is the at least one respective liquid flow channel to which the outlet chamber is fluidly coupled.

3. The memory cooler of claim 1 , wherein:
the at least one respective liquid flow channel of the at least one heat transfer tube is defined by a respective interior surface of the at least one heat transfer tube; and
the interior surface includes a plurality of surface extensions.

4. The memory cooler of claim 1 , wherein the at least one respective liquid flow channel has a rounded rectangular-shaped cross-section.

5. The memory cooler of claim 1 , wherein each of the heat transfer tubes is structurally integrated to the first end block at the respective first tube end and to the second end block at the respective second tube end.

6. An assembly, comprising:
a host printed circuit board (“PCB”);
a memory cooler mounted to the host PCB, the memory cooler including:
a unitary thermal transfer device including;
a plurality of heat transfer tubes, each heat transfer tube having a first tube end and a second tube end and defining a respective liquid flow channel;
a first end block structurally integrated with each of the heat transfer tubes at a respective first tube end of the at least one heat transfer tube;
a second end block structurally integrated with each of the heat transfer tubes at a respective second tube end;
an inlet chamber partially defined by the second end block, the inlet chamber fluidly coupled with at least one respective liquid flow channel of at least one of the heat transfer tubes;
an inlet to the inlet chamber;
an outlet chamber partially defined by the first end block, the outlet chamber fluidly coupled with at least one respective liquid flow channel of at least one of the heat transfer tubes; and

an outlet from the outlet chamber; and
a first endcap, the first endcap affixed to the first end block to define, in conjunction with the first end block, the outlet chamber and at least a first circulation chamber;
a second endcap, the second endcap affixed to the second end block to define, in conjunction with the second end block, the inlet chamber and at least a second circulation chamber; and

a plurality of memory boards plugged into the host board, each memory board being disposed in a respective slot defined by the heat transfer tubes of the unitary thermal transfer device.

7. The assembly of claim 6 , wherein:
the at least one respective liquid flow channel of the at least one heat transfer tube is defined by a respective interior surface of the at least one heat transfer tube; and
the interior surface includes a plurality of surface extensions.

8. The assembly of claim 6 , wherein the at least one respective liquid flow channel has a rounded rectangular-shaped cross-section.

9. The assembly of claim 6 , wherein each of the heat transfer tubes is structurally integrated to the first end block at the respective first tube end and to the second end block at the respective second tube end.

10. The assembly of claim 6 , further comprising a central processing unit (“CPU”) plugged into the host PCB.

11. A memory cooler, including:
a unitary thermal transfer device including:
a plurality of heat transfer tubes, each heat transfer tube having a first tube end and a second tube end and defining a respective liquid flow channel;
a first end block structurally integrated with each of the heat transfer tubes at a respective first tube end of the at least one heat transfer tube;
a second end block structurally integrated with each of the heat transfer tubes at a respective second tube end;
an inlet chamber partially defined by the second end block, the inlet chamber fluidly coupled with at least one respective liquid flow channel of at least one of the heat transfer tubes;
an inlet to the inlet chamber;
an outlet chamber partially defined by the second end block, the outlet chamber fluidly coupled with at least one respective liquid flow channel of at least one of the heat transfer tubes; and
an outlet from the outlet chamber;
a first endcap, the first endcap affixed to the first end block to define, in conjunction with the first end block, at least a first circulation chamber and a second circulation chamber; and
a second endcap, the second endcap affixed to the second end block to define, in conjunction with the second end block, the outlet chamber, the inlet chamber, and at least a third circulation chamber.

12. The memory cooler of claim 11 , wherein the at least one respective liquid flow channel to which the inlet chamber is fluidly coupled is the at least one respective liquid flow channel to which the outlet chamber is fluidly coupled.

13. The memory cooler of claim 11 , wherein:
the at least one respective liquid flow channel of the at least one heat transfer tube is defined by a respective interior surface of the at least one heat transfer tube; and
the interior surface includes a plurality of surface extensions.

14. The memory cooler of claim 11 , wherein the at least one respective liquid flow channel has a rounded rectangular-shaped cross-section.

15. The memory cooler of claim 11 , wherein each of the heat transfer tubes is structurally integrated to the first end block at the respective first tube end and to the second end block at the respective second tube end.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Franz John
• Ferrer Ernesto
• Cader Tahir

Classifications

• H05K7/20272 Primary

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• F28F9/0224

  Header boxes formed by sealing end plates into covers (F28F9/0221 takes precedence) · CPC title

• F28F9/0248

  Arrangements for sealing connectors to header boxes · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20218

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title