Multipoint contact conduction cooling of a removable device

Patent metadata

Field	Value
Publication number	US-11579668-B2
Application number	US-202017030677-A
Country	US
Kind code	B2
Filing date	Sep 24, 2020
Priority date	Sep 24, 2020
Publication date	Feb 14, 2023
Grant date	Feb 14, 2023

Abstract

Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

First claim

What is claimed is:

1. A host device comprising:
a host circuit board having a connector; and
a thermal management unit comprising:
a cooling component coupled to a portion of the host circuit board, wherein the cooling component comprises a partially protruded portion; and
a plurality of spring fingers spaced apart from each other, wherein each of the plurality of spring fingers comprises a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of a removable device to allow a waste-heat to transfer from the removable device to the cooling component through each spring finger, wherein the plurality of spring fingers are arranged adjacent to one another along a lateral direction and a longitudinal direction to form an array of spring fingers, and wherein the array of spring fingers are held together by a retainer element such that the first end and the second end of each spring finger protrudes outwards relative to a first peripheral surface and a second peripheral surface, respectively, of the retainer element.

2. The host device of claim 1 , wherein the plurality of spring fingers comprises at least one of a rotated “J” shaped geometry, a spatula shaped geometry, a loopback shaped geometry, an angled spoon shaped geometry, a cantilever shaped geometry, a mirrored “S” shaped geometry, or a twin rotated “J” shaped geometry.

3. The host device of claim 1 , wherein each of the plurality of spring fingers in the array of spring fingers is a discrete component.

4. The host device of claim 1 , wherein the plurality of spring fingers are coupled to each other to form a plurality of strips along the lateral direction or the longitudinal direction, wherein two or more spring fingers in each strip of the plurality of strips are held by the retainer element, and wherein each of the plurality of spring fingers in at least one strip of the plurality of strips comprises a rotated “J” shaped geometry, a spatula shaped geometry, a loopback shaped geometry, an angled spoon shaped geometry, a cantilever shaped geometry, a mirrored “S” shaped geometry, or a twin rotated “J” shaped geometry.

5. The host device of claim 1 , wherein each spring finger further comprises a body interconnecting the first and second ends, wherein the body and the second end of one or more spring fingers overlay with a portion of the body of a mutually adjacent spring finger, to allow the thermal management unit to have a substantially high density of the plurality of spring fingers in the array of spring fingers.

6. The host device of claim 1 , wherein the first end of each spring finger is coupled to the partially protruded portion using at least one of a thermally conductive adhesive, soldering, or brazing.

7. The host device of claim 1 , wherein the cooling component is one of a heat sink or a cold plate.

8. The host device of claim 1 , wherein the plurality of spring fingers comprises a plurality of first spring fingers and a plurality of second spring fingers disposed adjacent to each other, wherein each first spring finger has a first end, a second end, and a first body interconnecting the first and second ends, wherein each second spring finger has a first end, a second end, and a second body interconnecting the first and second ends, and wherein the first body is oriented in a first direction and the second body is oriented in a second direction opposite to the first direction.

9. An electronic system comprising:
a host device comprising a thermal management unit and a host circuit board having a connector, wherein the thermal management unit comprises:
a cooling component coupled to a portion of the host circuit board, wherein the cooling component comprises a partially protruded portion; and
a plurality of spring fingers spaced apart from each other, wherein each of the plurality of spring fingers comprises a first end coupled to the partially protruded portion, and a second end having a dry contact surface, wherein the plurality of spring fingers are arranged adjacent to one another along a lateral direction and a longitudinal direction to form an array of spring fingers, and wherein the array of spring fingers are held together by a retainer element such that the first end and the second end of each spring finger protrudes outwards relative to a first peripheral surface and a second peripheral surface, respectively, of the retainer element; and

a removable device comprising:
a circuit board communicatively coupled to the host circuit board via the connector;
a plurality of electronic components coupled to a portion of the circuit board, wherein the circuit board and the plurality of electronic components generates a waste-heat; and
a heat spreader coupled to at least one or more electronic components and the portion of the circuit board, wherein the heat spreader dissipates the waste-heat to a peripheral surface of the heat spreader, and

wherein the dry contact surface establishes a direct thermal interface with the peripheral surface to transfer the waste-heat from the removable device to the cooling component through each spring finger.

10. The electronic system of claim 9 , wherein the plurality of spring fingers comprises at least one of a rotated “J” shaped geometry, a spatula shaped geometry, a loopback shaped geometry, an angled spoon shaped geometry, a cantilever shaped geometry, a mirrored “S” shaped geometry, or a twin rotated “J” shaped geometry.

11. The electronic system of claim 9 , wherein each of the plurality of spring fingers in the array of spring fingers is a discrete component.

12. The electronic system of claim 9 , wherein the plurality of spring fingers are coupled to each other to form a plurality of strips along the lateral direction or the longitudinal direction, and wherein two or more spring fingers in each strip of the plurality of strips are held by the retainer element, and wherein each of the plurality of spring fingers in at least one strip of the plurality of strips comprises a rotated “J” shaped geometry, a spatula shaped geometry, a loopback shaped geometry, an angled spoon shaped geometry, a cantilever shaped geometry, a mirrored “S” shaped geometry, or a twin rotated “J” shaped geometry.

13. The electronic system of claim 9 , wherein the plurality of spring fingers is detachably connected to the removable device by allowing each spring finger to operate within a plurality of predefined ranges while maintaining the direct thermal interface with the removable device,
wherein the plurality of predefined ranges comprises at least one of a spring force per a contact point of the dry contact surface, a surface area per the contact point of the dry contact surface, or a deflection of the second end,
wherein the spring force of each spring finger is in a range from about 0.04 pound-force to 0.08 pound-force, wherein the surface area of each spring finger is in a range from about 0.2 square millimeter to 0.6 square millimeter, and wherein the deflection of each spring finger is in a range from about 0.5 millimeter to 1.0 millimeter.

14. The electronic system of claim 9 , wherein the removable device is a pluggable electronic device comprising a small form-factor pluggable (SFP) transceiver having an active optical cable (AOC).

15. The electronic system of claim 9 , wherein each spring finger further comprises a body interconnecting the first and second ends, wherein the body and the second end of one or more spring fingers overlay with a portion of the body of a mutually adjacent spring finger, to allow the

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Lunsman Harvey J
• Dean Steven
• Franz John
• Dulian Brady

Classifications

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K2201/10325

  Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K2201/10598

  Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB · CPC title

• H05K7/2049 Primary

  Pressing means used to urge contact, e.g. springs · CPC title