Method and system for 3d reconstruction of wafer structure by diagonal milling
US-2025391707-A1 · Dec 25, 2025 · US
Eytan Guy is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Eytan Guy |
| Total patents | 28 |
| First publication | Jan 17, 2019 |
| Latest publication | Dec 25, 2025 |
Publications ranked by popularity score, then publication date.
US-2025391707-A1 · Dec 25, 2025 · US
US-2025341481-A1 · Nov 6, 2025 · US
US-12456600-B2 · Oct 28, 2025 · US
US-2025095955-A1 · Mar 20, 2025 · US
US-2024404784-A1 · Dec 5, 2024 · US
US-11921063-B2 · Mar 5, 2024 · US
US-11810765-B2 · Nov 7, 2023 · US
US-11694869-B2 · Jul 4, 2023 · US
US-2023023363-A1 · Jan 26, 2023 · US
US-2022199370-A1 · Jun 23, 2022 · US
Latest publications not already listed above.
US-2022181115-A1 · Jun 9, 2022 · US
US-11355309-B2 · Jun 7, 2022 · US
US-11264202-B2 · Mar 1, 2022 · US
US-11189451-B2 · Nov 30, 2021 · US
US-2021358712-A1 · Nov 18, 2021 · US
US-2021319976-A1 · Oct 14, 2021 · US
US-11049704-B1 · Jun 29, 2021 · US
US-2021175040-A1 · Jun 10, 2021 · US
US-10910204-B2 · Feb 2, 2021 · US
US-10886092-B2 · Jan 5, 2021 · US
US-2020234907-A1 · Jul 23, 2020 · US
US-10716197-B2 · Jul 14, 2020 · US
US-2020013603-A1 · Jan 9, 2020 · US
US-10249472-B2 · Apr 2, 2019 · US
US-2019090335-A1 · Mar 21, 2019 · US
US-10217621-B2 · Feb 26, 2019 · US
US-2019027354-A1 · Jan 24, 2019 · US
US-2019019649-A1 · Jan 17, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Israel Ltd | 26 |
| Ict Integrated Circuit Testing Ges Fuer Halbleiterprueftechnik Mbh | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/28 | 14 |
| G01N23/2251 | 11 |
| G01N2223/6116 | 9 |
| G01N2223/418 | 7 |
| H01J37/244 | 7 |