Method for fabricating a semiconductor device using wet etching and dry etching and semiconductor device
US-12525555-B2 · Jan 13, 2026 · US
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Ehmann Michael patents
Ehmann Michael is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ehmann Michael |
| Total patents | 12 |
| First publication | Dec 1, 2016 |
| Latest publication | Jan 13, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for fabricating a semiconductor device using wet etching and dry etching and semiconductor device
US-2024318320-A1 · Sep 26, 2024 · US
Method for fabricating a semiconductor device using wet etching and dry etching and semiconductor device
US-12018387-B2 · Jun 25, 2024 · US
Electronic device, electronic module and methods for fabricating the same
US-11615963-B2 · Mar 28, 2023 · US
Method for fabricating a semiconductor device using wet etching and dry etching and semiconductor device
US-2022235470-A1 · Jul 28, 2022 · US
Electronic device, electronic module and methods for fabricating the same
US-2020343094-A1 · Oct 29, 2020 · US
Electronic device, electronic module and methods for fabricating the same
US-10741402-B2 · Aug 11, 2020 · US
Solder metallization stack and methods of formation thereof
US-10573611-B2 · Feb 25, 2020 · US
Solder Metallization Stack and Methods of Formation Thereof
US-2019051624-A1 · Feb 14, 2019 · US
Solder metallization stack and methods of formation thereof
US-10115688-B2 · Oct 30, 2018 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
| Infineon Technologies Austria Ag | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/952 | 12 |
| H10W72/923 | 12 |
| H10W72/073 | 12 |
| H10W72/951 | 8 |
| H10W72/019 | 8 |