Electronic device, electronic module and methods for fabricating the same

Patent metadata

Field	Value
Publication number	US-10741402-B2
Application number	US-201715692495-A
Country	US
Kind code	B2
Filing date	Aug 31, 2017
Priority date	Sep 21, 2016
Publication date	Aug 11, 2020
Grant date	Aug 11, 2020

Abstract

An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.

First claim

The invention claimed is:

1. An electronic device, comprising:
a semiconductor substrate; and
a metal stack that completely covers a backside of the semiconductor substrate, the metal stack comprising:
a first layer;

wherein the first layer comprises NiSi; and
wherein the metal stack comprises N impurities in the first layer, in the form of one or more of NiN and SiN.

2. The electronic device according to claim 1 , wherein the first layer has a thickness in the range of 50 nm to 2000 nm.

3. The electronic device according to claim 1 , wherein the first layer comprises an amount of Si in the range of 2 wt % to 50 wt %.

4. An electronic module, comprising:
a carrier;
a semiconductor chip disposed on the carrier;
a metal stack that completely covers a backside of the semiconductor chip, the metal stack disposed between the carrier and the semiconductor chip, the metal stack comprising:
a first layer comprising NiSi, and
a solder layer disposed on the first layer;

an encapsulation body encapsulating the semiconductor chip and the metal stack disposed between the carrier and the semiconductor chip; and
wherein the metal stack comprises N impurities.

5. The electronic module according to claim 4 , wherein the solder layer comprises a Pb-based or a Pb-free solder.

6. The electronic module according to claim 5 , wherein the solder layer comprises Sn or SnAg.

7. The electronic module according to claim 4 , wherein the carrier comprises a power electronic substrate, a leadframe, a DCB, a DAB, an AMB, an IMS or a PCB.

8. The electronic module according to claim 4 , wherein N impurities are located along an interface between the first layer and the solder layer.

9. A method for fabricating an electronic module, comprising:
providing a carrier and a semiconductor substrate;
disposing a first layer on a backside of the semiconductor substrate, wherein the first layer completely covers the backside of the semiconductor substrate;
disposing a solder layer between the first layer and the carrier; and
soldering the semiconductor substrate onto the carrier,
wherein the first layer comprises NiSi, and
wherein disposing the first layer on the semiconductor substrate comprises sputtering in the presence of a process gas.

10. The method according to claim 9 , wherein sputtering comprises a magnetron sputtering process.

11. The method according to claim 9 , wherein the process gas comprises N, and wherein the amount of N in the process gas is about 80%.

12. The method according to claim 9 , wherein the process gas further comprises Ar, Xe, Kr or Ne.

13. The method according to claim 9 comprising forming intermetallic phases between the first layer and the solder layer.

Assignees

• Infineon Technologies Ag

Inventors

• Frank Paul
• Adema Gretchen
• Bertaud Thomas
• Ehmann Michael
• Graetz Eric
• Karlovsky Kamil
• Napetschnig Evelyn
• Robl Werner
• Schmidt Tobias
• Seifert Joachim
• Wagner Frank
• Woehlert Stefan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/01938

  in gaseous form, e.g. by CVD or PVD · CPC title

• H10W72/07336

  Soldering or alloying · CPC title