Substrate carrier
US-12125728-B2 · Oct 22, 2024 · US
Diehl Daniel Lee is listed as an inventor on 52 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Diehl Daniel Lee |
| Total patents | 52 |
| First publication | May 14, 2015 |
| Latest publication | Oct 22, 2024 |
Publications ranked by popularity score, then publication date.
US-12125728-B2 · Oct 22, 2024 · US
US-11994800-B2 · May 28, 2024 · US
US-2024003000-A1 · Jan 4, 2024 · US
US-11802349-B2 · Oct 31, 2023 · US
US-11778926-B2 · Oct 3, 2023 · US
US-11739418-B2 · Aug 29, 2023 · US
US-2023115004-A1 · Apr 13, 2023 · US
US-11575071-B2 · Feb 7, 2023 · US
US-11550222-B2 · Jan 10, 2023 · US
US-2022384705-A1 · Dec 1, 2022 · US
Latest publications not already listed above.
US-11495461-B2 · Nov 8, 2022 · US
US-11437559-B2 · Sep 6, 2022 · US
US-11313034-B2 · Apr 26, 2022 · US
US-2021328104-A1 · Oct 21, 2021 · US
US-11081623-B2 · Aug 3, 2021 · US
US-11056277-B2 · Jul 6, 2021 · US
US-2021123156-A1 · Apr 29, 2021 · US
US-2021033974-A1 · Feb 4, 2021 · US
US-10886155-B2 · Jan 5, 2021 · US
US-D904640-S · Dec 8, 2020 · US
US-2020299830-A1 · Sep 24, 2020 · US
US-2020303616-A1 · Sep 24, 2020 · US
US-2020273705-A1 · Aug 27, 2020 · US
US-2020234991-A1 · Jul 23, 2020 · US
US-2020211769-A1 · Jul 2, 2020 · US
US-2020127164-A1 · Apr 23, 2020 · US
US-10546973-B2 · Jan 28, 2020 · US
US-2019212656-A1 · Jul 11, 2019 · US
US-2019172973-A1 · Jun 6, 2019 · US
US-10236412-B2 · Mar 19, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 52 |
| IBM | 1 |
| Applied Mat | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C14/0042 | 14 |
| H01J37/3405 | 13 |
| H10P76/4085 | 12 |
| H10H20/0137 | 12 |
| H01L33/0075 | 12 |