Method and apparatus for deposition of multilayer device with superconductive film

Patent metadata

Field	Value
Publication number	US-11437559-B2
Application number	US-202016823206-A
Country	US
Kind code	B2
Filing date	Mar 18, 2020
Priority date	Mar 22, 2019
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

A physical vapor deposition system includes a chamber, three target supports to targets, a movable shield positioned having an opening therethrough, a workpiece support to hold a workpiece in the chamber, a gas supply to deliver nitrogen gas and an inert gas to the chamber, a power source, and a controller. The controller is configured to move the shield to position the opening adjacent each target in turn, and at each target cause the power source to apply power sufficient to ignite a plasma in the chamber to cause deposition of a buffer layer, a device layer of a first material that is a metal nitride suitable for use as a superconductor at temperatures above 8° K on the buffer layer, and a capping layer, respectively.

First claim

What is claimed is:

1. A method of forming a device on a workpiece, comprising:
carrying the workpiece with a robot from a load lock chamber through a central vacuum chamber into a first deposition chamber;
depositing a buffer layer that is a nitride of a first metal on the workpiece in the first deposition chamber;
carrying the workpiece with the robot from the first deposition chamber through the central vacuum chamber to a second deposition chamber;
depositing a metal nitride layer suitable for use as a superconductor at temperatures above 8° K on the buffer layer in the second deposition chamber, wherein the metal nitride layer is a nitride of a second metal different than the first metal;
carrying the workpiece with the robot from the second deposition chamber through the central vacuum chamber to third deposition chamber;
depositing a capping layer on the metal nitride layer in the third deposition chamber.

2. The method of claim 1 , wherein the metal nitride layer comprises niobium nitride or a niobium alloy nitride.

3. The method of claim 1 , wherein the capping layer comprises carbon, silicon, a metal different than a metal of a target used for depositing the metal nitride layer, or a nitride of a material different than the metal of the target.

4. The method of claim 1 , comprising evacuating the central vacuum chamber and the second deposition chamber to a pressure less than 10 −8 Torr.

5. The method of claim 1 , wherein each of depositing the buffer layer, depositing the metal nitride layer, and depositing the capping layer comprises physical vapor deposition including generating a plasma to sputter a target.

6. The method of claim 1 , wherein depositing the buffer layer, depositing the metal nitride layer, and depositing the capping layer are performed without removing the workpiece from a vacuum environment.

7. The method of claim 1 , wherein the capping layer comprises a nitride of a third metal different than the first metal of the metal nitride layer and different than the second metal of the buffer layer.

8. A method of forming a device on a workpiece, comprising:
carrying the workpiece with a robot from a load lock chamber through a central vacuum chamber into a first deposition chamber;
depositing an aluminum nitride buffer layer on the workpiece in the first deposition chamber;
carrying the workpiece with the robot from the first deposition chamber through the central vacuum chamber to a second deposition chamber;
depositing a niobium nitride layer suitable for use as a superconductor at temperatures above 8° K on the buffer layer in the second deposition chamber;
carrying the workpiece with the robot from the second deposition chamber through the central vacuum chamber to third deposition chamber;
depositing a titanium nitride capping layer on the niobium nitride layer in the third deposition chamber.

9. A method of forming a device on a workpiece, comprising:
carrying the workpiece with a robot from a load lock chamber through a central vacuum chamber into a first deposition chamber;
depositing a buffer layer comprising a nitride of a first metal on the workpiece in the first deposition chamber, the nitride of the first metal having a (002) c-axis crystal orientation;
carrying the workpiece with the robot from the first deposition chamber through the central vacuum chamber to a second deposition chamber;
depositing a metal nitride layer comprising a second metal suitable for use as a superconductor at temperatures above 8° K on the buffer layer in the second deposition chamber, wherein the second metal is different than the first metal;
carrying the workpiece with the robot from the second deposition chamber through the central vacuum chamber to third deposition chamber;
depositing a capping layer on the metal nitride layer in the third deposition chamber.

10. The method of claim 9 , wherein the capping layer comprises carbon, silicon, a metal different than a metal of a target used for depositing the metal nitride layer, or a nitride of a material different than the metal of the target.

11. The method of claim 8 , wherein each of depositing the buffer layer, depositing the niobium nitride layer, and depositing the capping layer comprises physical vapor deposition including generating a plasma to sputter a target.

12. The method of claim 8 , wherein depositing the buffer layer, depositing the niobium nitride layer, and depositing the capping layer are performed without removing the workpiece from a vacuum environment.

13. The method of claim 9 , wherein the capping layer comprises a nitride of a third metal different than the first metal of the metal nitride layer and different than the second metal of the buffer layer.

Assignees

• Applied Materials Inc

Inventors

• Zhu Mingwei
• Yang Zihao
• Patibandla Nag B
• Godet Ludovic
• Cao Yong
• Diehl Daniel Lee
• Chen Zhebo

Classifications

• C23C14/54

  Controlling or regulating the coating process · CPC title

• G01J1/44

  Electric circuits {(for command of an exposure part G03B7/02)} · CPC title

• C23C14/0036

  Reactive sputtering · CPC title

• C23C14/0641 Primary

  Nitrides (C23C14/0617 takes precedence) · CPC title

• G01J2001/442

  Single-photon detection or photon counting · CPC title