Dose reduction of patterned metal oxide photoresists

Patent metadata

Field	Value
Publication number	US-11550222-B2
Application number	US-202016890867-A
Country	US
Kind code	B2
Filing date	Jun 2, 2020
Priority date	Aug 1, 2019
Publication date	Jan 10, 2023
Grant date	Jan 10, 2023

Abstract

Embodiments of the present disclosure generally relate to a multilayer stack used as a mask in extreme ultraviolet (EUV) lithography and methods for forming a multilayer stack. In one embodiment, the method includes forming a carbon layer over a film stack, forming a metal rich oxide layer on the carbon layer by a physical vapor deposition (PVD) process, forming a metal oxide photoresist layer on the metal rich oxide layer, and patterning the metal oxide photoresist layer. The metal oxide photoresist layer is different from the metal rich oxide layer and is formed by a process different from the PVD process. The metal rich oxide layer formed by the PVD process improves adhesion of the metal oxide photoresist layer and increases the secondary electrons during EUV lithography, which leads to decreased EUV dose energies.

First claim

What is claimed is:

1. A method for forming a multilayer stack, comprising:
forming a first layer on a film stack, the first layer comprising a carbon-containing layer;
forming a second layer on the first layer by a physical vapor deposition process, the second layer comprising a metal rich oxide layer; and
forming a metal oxide photoresist layer on the second layer, the metal oxide photoresist layer comprising a material different from the second layer.

2. The method of claim 1 , wherein the first layer further comprises a doped carbon-containing layer.

3. The method of claim 2 , wherein the first layer further comprises a boron doped carbon layer.

4. The method of claim 1 , wherein the first layer further comprises a carbon-containing layer having a density greater than about 1.8 g/cc.

5. The method of claim 4 , wherein the carbon-containing layer is a diamond-like carbon layer.

6. The method of claim 1 , wherein the second layer further comprises a high Z metal.

7. The method of claim 1 , wherein the second layer further comprises one or more of tin, indium, gallium, zinc, tellurium, antimony, nickel, titanium, aluminum, or tantalum.

8. The method of claim 7 , wherein the second layer is a tin oxide layer, an indium gallium zinc oxide layer, an indium tin oxide layer, or a tantalum oxide layer.

9. A multilayer stack used as a mask in extreme ultraviolet lithography, comprising:
a first layer disposed on a film stack, the first layer comprising a carbon-containing layer;
a second layer disposed on the first layer, the second layer comprising a metal rich oxide layer; and
a metal oxide photoresist layer disposed on the second layer, the metal oxide photoresist layer comprising a material different from the second layer.

10. The multilayer stack of claim 9 , wherein the first layer further comprises a doped carbon-containing layer.

11. The multilayer stack of claim 10 , wherein the first layer further comprises a boron doped carbon layer.

12. The multilayer stack of claim 9 , wherein the first layer further comprises a carbon-containing layer having a density greater than about 1.8 g/cc.

13. The multilayer stack of claim 12 , wherein the carbon-containing layer is a diamond-like carbon layer.

14. The multilayer stack of claim 9 , wherein the second layer further comprises a high Z metal.

15. The multilayer stack of claim 9 , wherein the second layer further comprises one or more of tin, indium, gallium, zinc, tellurium, antimony, nickel, titanium, aluminum, or tantalum.

16. The multilayer stack of claim 15 , wherein the second layer is a tin oxide layer, an indium gallium zinc oxide layer, an indium tin oxide layer, or a tantalum oxide layer.

17. The multilayer stack of claim 12 , wherein the second layer is a tin oxide layer, an indium gallium zinc oxide layer, an indium tin oxide layer, or a tantalum oxide layer.

18. A non-transitory computer readable storage medium having stored thereon a plurality of instructions, the plurality of instructions including instructions to control components of a processing system to perform the process of:
forming a first layer on a film stack, the first layer comprising a carbon-containing layer having a density greater than about 1.8 g/cc; and
forming a second layer on the first layer by a physical vapor deposition process, the second layer comprising one or more of tin, indium, gallium, zinc, tellurium, antimony, nickel, titanium, aluminum, or tantalum.

19. The non-transitory computer readable storage medium of claim 18 , wherein the first layer is a diamond-like carbon layer.

20. The non-transitory computer readable storage medium of claim 18 , wherein the second layer is a tin oxide layer, an indium gallium zinc oxide layer, an indium tin oxide layer, or a tantalum oxide layer.

Assignees

• Applied Materials Inc

Inventors

• Singh Tejinder
• Yan Lifan
• Mallick Abhijit B
• Diehl Daniel Lee
• Hwang Ho-Yung
• Ramalingam Jothilingam

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• H10P76/405 Primary

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P50/692

  characterised by their composition, e.g. multilayer masks or materials · CPC title

• G03F7/091

  characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement · CPC title

• G03F7/0043

  Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof (G03F7/0044 takes precedence) · CPC title