Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
US-9673109-B2 · Jun 6, 2017 · US
Cutler Daniel is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cutler Daniel |
| Total patents | 16 |
| First publication | Apr 21, 2015 |
| Latest publication | Jun 6, 2017 |
Publications ranked by popularity score, then publication date.
US-9673109-B2 · Jun 6, 2017 · US
US-9576887-B2 · Feb 21, 2017 · US
US-9502395-B2 · Nov 22, 2016 · US
US-9397212-B2 · Jul 19, 2016 · US
US-9362221-B2 · Jun 7, 2016 · US
US-2016155674-A1 · Jun 2, 2016 · US
US-9299690-B2 · Mar 29, 2016 · US
US-9269655-B2 · Feb 23, 2016 · US
US-2016035699-A1 · Feb 4, 2016 · US
US-2016027767-A1 · Jan 28, 2016 · US
Latest publications not already listed above.
US-2015348888-A1 · Dec 3, 2015 · US
US-2015348887-A1 · Dec 3, 2015 · US
US-9159703-B2 · Oct 13, 2015 · US
US-9111921-B2 · Aug 18, 2015 · US
US-2015221588-A1 · Aug 6, 2015 · US
US-9012990-B2 · Apr 21, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Americas Corp | 10 |
| Int Rectifier Corp | 9 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 16 |
| H10W72/874 | 13 |
| H10W90/736 | 13 |
| H10W90/811 | 13 |
| H10W70/481 | 13 |