Three-dimensional microelectronic package with embedded cooling channels
US-11462512-B2 · Oct 4, 2022 · US
Corliss Daniel is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Corliss Daniel |
| Total patents | 19 |
| First publication | May 30, 2019 |
| Latest publication | Oct 4, 2022 |
Publications ranked by popularity score, then publication date.
US-11462512-B2 · Oct 4, 2022 · US
US-11288429-B2 · Mar 29, 2022 · US
US-11177130-B2 · Nov 16, 2021 · US
US-11037786-B2 · Jun 15, 2021 · US
US-2021118854-A1 · Apr 22, 2021 · US
US-10937764-B2 · Mar 2, 2021 · US
US-10921715-B2 · Feb 16, 2021 · US
US-10921716-B1 · Feb 16, 2021 · US
US-2020294968-A1 · Sep 17, 2020 · US
US-10650111-B2 · May 12, 2020 · US
Latest publications not already listed above.
US-2020143098-A1 · May 7, 2020 · US
US-2019346773-A1 · Nov 14, 2019 · US
US-10429743-B2 · Oct 1, 2019 · US
US-2019267234-A1 · Aug 29, 2019 · US
US-2019259601-A1 · Aug 22, 2019 · US
US-10347486-B1 · Jul 9, 2019 · US
US-2019189428-A1 · Jun 20, 2019 · US
US-2019163857-A1 · May 30, 2019 · US
US-2019163071-A1 · May 30, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 19 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F30/30 | 8 |
| G03F7/705 | 8 |
| G03F7/2004 | 7 |
| H10P76/405 | 6 |
| H10P76/4085 | 6 |