Method and system for die to wafer bonding
US-2026099099-A1 · Apr 9, 2026 · US
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Conklin David patents
Conklin David is listed as an inventor on 38 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Conklin David |
| Total patents | 38 |
| First publication | Feb 17, 2022 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Fill shape optimization for substrate bonding
US-2026068690-A1 · Mar 5, 2026 · US
Monomer and polymer compositions for reversible overcoat wafer patterning
US-2026063989-A1 · Mar 5, 2026 · US
Top-down self-alignment of vias in a semiconductor device for sub-22NM pitch metals
US-12564027-B2 · Feb 24, 2026 · US
Coaxial see-through inspection system
US-12541155-B2 · Feb 3, 2026 · US
Patterning method using secondary resist surface functionalization for mask formation
US-12543542-B2 · Feb 3, 2026 · US
Pitch splitting for euv imaging
US-2026029717-A1 · Jan 29, 2026 · US
Apparatus and method for wafer alignment
US-12512356-B2 · Dec 30, 2025 · US
Using laser based system for mean of shaping of unsingulated & singulated dies by substrate lattice manipulation
US-2025308902-A1 · Oct 2, 2025 · US
Die to wafer bonding method and apparatus with thermal contact die shape control
US-2025308949-A1 · Oct 2, 2025 · US
Recent patents
Latest publications not already listed above.
Patterning a substrate using a multi-patterning technique
US-2025306463-A1 · Oct 2, 2025 · US
Die to wafer bonding method and apparatus with thermal contactless die shape control
US-2025308951-A1 · Oct 2, 2025 · US
Multipatterning with crosslinkable overcoat
US-2025306468-A1 · Oct 2, 2025 · US
Autocatalytic acid amplification for photoselective acid diffusion
US-2025298316-A1 · Sep 25, 2025 · US
Method for patterning for chemical mechanical polishing (cmp) iso-dense bias compensation using z-height
US-2025300010-A1 · Sep 25, 2025 · US
Photoresist patterning using planar trim layer
US-2025298319-A1 · Sep 25, 2025 · US
Patterning semiconductor features
US-12411412-B2 · Sep 9, 2025 · US
Die shape control for die to wafer bond enhancement
US-2025259943-A1 · Aug 14, 2025 · US
3D multiple location compressing bonded arm for advanced integration
US-12381118-B2 · Aug 5, 2025 · US
Correcting of design and mask shape position due to die and wafer distortion for bonding
US-2025226265-A1 · Jul 10, 2025 · US
Critical dimension uniformity tuning based on mask design feature density
US-2025189901-A1 · Jun 12, 2025 · US
Fully self-aligned vias using a hardmask and antispacers
US-2025191970-A1 · Jun 12, 2025 · US
Reversible overcoat compositions
US-2025172877-A1 · May 29, 2025 · US
Methods and compositions for trench formation using advanced track-based patterning processes
US-2025029837-A1 · Jan 23, 2025 · US
Formation of sub-lithographic mandrel patterns using reversible overcoat
US-2024419074-A1 · Dec 19, 2024 · US
Inorganic/hybrid stress films
US-2024363340-A1 · Oct 31, 2024 · US
Apparatus and method for wafer alignment
US-2024203778-A1 · Jun 20, 2024 · US
Three-dimensional multiple location compressing bonded arm-poisedon 4 and poisedon 5 advanced integration
US-2024203797-A1 · Jun 20, 2024 · US
Patterning Semiconductor Features
US-2024168384-A1 · May 23, 2024 · US
Patterning Method Using Secondary Resist Surface Functionalization for Mask Formation
US-2024030029-A1 · Jan 25, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 38 |
| Toyko Electron Ltd | 1 |
| Univ Queensland | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/0035 | 9 |
| H10P74/23 | 9 |
| H10P76/204 | 8 |
| H10P76/4085 | 8 |
| H10P50/73 | 8 |