Voltage regulator module having a power stage
US-12575023-B2 · Mar 10, 2026 · US
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Chua Kok Yau patents
Chua Kok Yau is listed as an inventor on 46 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chua Kok Yau |
| Total patents | 46 |
| First publication | Oct 25, 2016 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Circuit with counterrotational circuit paths
US-2026066893-A1 · Mar 5, 2026 · US
Package with carrier having plated bottom surface and sidewall
US-2025226297-A1 · Jul 10, 2025 · US
Molded power package with vertical interconnect
US-2025140729-A1 · May 1, 2025 · US
Package with Vertical Electronic Components Held Together by a Clip
US-2025062273-A1 · Feb 20, 2025 · US
Method for fabricating topside cooled semiconductor packages by film assisted molding and a semiconductor package
US-2025054831-A1 · Feb 13, 2025 · US
Power module with inductor-cooled power stage
US-2025048531-A1 · Feb 6, 2025 · US
Leadframe, semiconductor package and method
US-12218038-B2 · Feb 4, 2025 · US
Voltage regulator module with inductor-cooled power stage
US-12150236-B2 · Nov 19, 2024 · US
Semiconductor package with floating metal portion and method for manufacturing
US-2024343553-A1 · Oct 17, 2024 · US
Recent patents
Latest publications not already listed above.
Power semiconductor package including a passive electronic component and method for fabricating the same
US-2024312936-A1 · Sep 19, 2024 · US
Voltage regulator module having a power stage
US-2024314926-A1 · Sep 19, 2024 · US
Package with clip having through hole accommodating component-related structure
US-12027436-B2 · Jul 2, 2024 · US
Package for a lateral power transistor
US-2024162136-A1 · May 16, 2024 · US
Voltage regulator module with inductor-cooled power stage
US-2023371165-A1 · Nov 16, 2023 · US
Method for Fabricating an Electrical Device Package Comprising Plateable Encapsulating Layers
US-2022375883-A1 · Nov 24, 2022 · US
Method for connecting an electrical device to a bottom unit by using a solderless joint
US-2022278085-A1 · Sep 1, 2022 · US
Package with clip having through hole accommodating component-related structure
US-2022254696-A1 · Aug 11, 2022 · US
Semiconductor package having a laser-activatable mold compound
US-11289436-B2 · Mar 29, 2022 · US
Pressure sensor having a lidless/laminate structure
US-11274984-B2 · Mar 15, 2022 · US
Over-under sensor packaging with sensor spaced apart from control chip
US-11174152-B2 · Nov 16, 2021 · US
Manufacturing a package using plateable encapsulant
US-11081417-B2 · Aug 3, 2021 · US
Package with acoustic sensing device(s) and millimeter wave sensing elements
US-11039231-B2 · Jun 15, 2021 · US
Pressure Sensor
US-2021025774-A1 · Jan 28, 2021 · US
Semiconductor Package Having a Laser-Activatable Mold Compound
US-2020381380-A1 · Dec 3, 2020 · US
Semiconductor package with air cavity
US-10777536-B2 · Sep 15, 2020 · US
Package with acoustic sensing device(s) and millimeter wave sensing elements
US-2020154183-A1 · May 14, 2020 · US
Micro-electrical mechanical system sensor package and method of manufacture thereof
US-10631100-B2 · Apr 21, 2020 · US
Micro-electrical mechanical system sensor package and method of manufacture thereof
US-2020084550-A1 · Mar 12, 2020 · US
Leadframe, Semiconductor Package and Method
US-2020051898-A1 · Feb 13, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 32 |
| Infineon Technologies Austria Ag | 14 |
| Infineon Technologies Americas Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 13 |
| H10W70/65 | 12 |
| H10W42/20 | 10 |
| H01L23/552 | 10 |
| H10W74/10 | 10 |