Package with clip having through hole accommodating component-related structure

Patent metadata

Field	Value
Publication number	US-12027436-B2
Application number	US-202217575038-A
Country	US
Kind code	B2
Filing date	Jan 13, 2022
Priority date	Feb 10, 2021
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.

First claim

What is claimed is:

1. A package, wherein the package comprises:
a carrier;
at least one component mounted on the carrier; and
a clip comprising a clip material and arranged above the carrier and having a through hole, the through hole comprising a perimeter entirely surrounded by the clip material;
wherein at least part of at least one of the at least one component is at least partially positioned inside the through hole.

2. The package according to claim 1 , wherein the clip is mounted on and electrically connected with the carrier and/or the clip is mounted on and electrically connected with at least one of the at least one component.

3. The package according to claim 1 , wherein the at least one component comprises at least one of the group consisting of at least one electronic component, at least one active component, at least one passive component, at least one semiconductor chip, at least one component experiencing vertical current flow during operation, at least one power component, at least one driver component, at least one thermally conductive and/or electrically conductive block, and a pillar.

4. The package according to claim 1 , comprising an encapsulant at least partially encapsulating at least one of the at least one component, the carrier, an electrically conductive connection element electrically connecting the at least one component, and the clip.

5. The package according to claim 4 , wherein a surface portion of the clip is exposed with respect to the encapsulant.

6. The package according to claim 5 , wherein the further component is mounted on the surface portion of the clip being exposed with respect to the encapsulant.

7. The package according to claim 6 , wherein the further component is mounted on a surface portion of a metal block being exposed with respect to the encapsulant.

8. The package according to claim 1 , comprising a further component, in particular a passive component, more particularly an inductor component, mounted on top of the clip.

9. The package according to claim 1 , comprising a metal block mounted on the carrier.

10. The package according to claim 1 , comprising at least one of the following features:
wherein the at least one component comprises a first power component, a second power component, and a driver component;
wherein the at least one component comprises at least one passive component.

11. The package according to claim 1 , wherein the at least part of the at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component protrudes vertically into, in particular vertically above, the through hole.

12. The package according to claim 1 , wherein an electrically conductive connection element electrically connecting the at least one component comprises at least one of the group consisting of at least one bond wire, and at least one further clip.

13. The package according to claim 1 , wherein an electrically conductive connection element electrically connects at least one of the at least one component with the carrier and/or with another one of the at least one component.

14. The package according to claim 1 , wherein at least one of the at least one component is located completely within an outline of the clip in a top view.

15. The package according to claim 1 , wherein the clip comprises at least one lateral recess, in particular extending into an edge and/or into a corner of the clip, accommodating at least part of at least one of the at least one component.

16. The package according to claim 1 , wherein the clip comprises at least one further through hole.

17. The package according to claim 1 , wherein at least one of the at least one component is a bare die.

18. The package according to claim 1 , wherein at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.

19. An electronic device, comprising:
a package according to claim 1 ; and
a mounting base on which the package is mounted.

20. A method of manufacturing a package, wherein the method comprises:
mounting at least one component on a carrier;
arranging a clip comprising a clip material, having a through hole comprising a perimeter entirely surrounded by the clip material, above the carrier; and
at least partially positioning at least part of at least one of the at least one component inside the through hole.

Assignees

• Infineon Technologies Ag

Inventors

• Kessler Angela
• Chua Kok Yau
• Hoeglauer Josef
• Lim Chiah Chin
• Tay Mei Qi

Classifications

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/421

  Shapes or dispositions · CPC title

• H10W90/763

  between laterally-adjacent chips · CPC title