Electronic device and device function search method thereof
US-12554729-B2 · Feb 17, 2026 · US
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Chen Wei-Cheng patents
Chen Wei-Cheng is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Wei-Cheng |
| Total patents | 49 |
| First publication | Jan 29, 2015 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit package structure
US-2026026372-A1 · Jan 22, 2026 · US
Electric power utilization abnormality monitoring method and system
US-2026003414-A1 · Jan 1, 2026 · US
Acute respiratory distress syndrome evaluating method and system thereof
US-2025241607-A1 · Jul 31, 2025 · US
Electronic device and device function search method thereof
US-2025156428-A1 · May 15, 2025 · US
Manufacturing method of electronic package and electronic package
US-2025149431-A1 · May 8, 2025 · US
Manufacturing method of electronic package and electronic package
US-2024421096-A1 · Dec 19, 2024 · US
Manufacturing method of electronic package and electronic package
US-2024421124-A1 · Dec 19, 2024 · US
Gesture determining method and electronic device
US-2023011763-A1 · Jan 12, 2023 · US
Calibration method for current detection and protection mechanism and calibration device using same
US-11455267-B1 · Sep 27, 2022 · US
Recent patents
Latest publications not already listed above.
Product detection device, product detection system and product detection method applied thereto
US-11449121-B2 · Sep 20, 2022 · US
Camera module
US-11445092-B2 · Sep 13, 2022 · US
Product detection device, product detection system and product detection method applied thereto
US-2022164017-A1 · May 26, 2022 · US
Chip package array, and chip package
US-11227848-B2 · Jan 18, 2022 · US
Array substrate for reducing parasitic capacitance between adjacent wires, display panel, and display device
US-11226528-B2 · Jan 18, 2022 · US
Display panel, gate scanning circuit, and gate scanning unit circuit
US-11217139-B2 · Jan 4, 2022 · US
Chip package process
US-11081371-B2 · Aug 3, 2021 · US
Array substrate, display panel, and display device
US-2021215983-A1 · Jul 15, 2021 · US
Array substrate, display panel, and display device
US-2021215982-A1 · Jul 15, 2021 · US
Camera module
US-2021105390-A1 · Apr 8, 2021 · US
Array substrate, display panel and display device
US-10962851-B1 · Mar 30, 2021 · US
Display device
US-10890794-B2 · Jan 12, 2021 · US
Display panel, gate scanning circuit, and gate scanning unit circuit
US-2020312211-A1 · Oct 1, 2020 · US
Chip packaging method
US-10756077-B2 · Aug 25, 2020 · US
Multi-layer circuit board structure
US-10701807-B2 · Jun 30, 2020 · US
Display device
US-2020174301-A1 · Jun 4, 2020 · US
Multi-layer circuit board structure
US-2020113052-A1 · Apr 9, 2020 · US
Chip package structure and chip package structure array
US-10504847-B2 · Dec 10, 2019 · US
Probe card
US-10459007-B2 · Oct 29, 2019 · US
Chip package structure and chip package structure array
US-2019139898-A1 · May 9, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hon Hai Prec Ind Co Ltd | 12 |
| Via Tech Inc | 10 |
| Asustek Comp Inc | 4 |
| Chicony Electronics Co Ltd | 4 |
| Shanghai Zhaoxin Semiconductor Co Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 9 |
| H10W70/60 | 8 |
| H10W90/724 | 7 |
| H10W74/142 | 7 |
| H10W70/09 | 7 |