Camera module

Patent metadata

Field	Value
Publication number	US-11445092-B2
Application number	US-202016812387-A
Country	US
Kind code	B2
Filing date	Mar 9, 2020
Priority date	Oct 8, 2019
Publication date	Sep 13, 2022
Grant date	Sep 13, 2022

Abstract

A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.

First claim

What is claimed is:

1. A camera module, comprising:
a circuit board having a surface;
an image sensor disposed on the surface;
a lens holder disposed on the surface and having an inner space;
a filter removable switch located over the surface;
a camera lens on a light-sensing path of the image sensor; and
a thermally conductive structure contacted between the circuit board and the filter removable switch and having a channel, wherein the image sensor is located in the channel and the thermally conductive structure is located in the inner space of the lens holder, and an outer side surface of the thermally conductive structure and an inner side surface of the lens holder face each other and are spaced apart from each other.

2. The camera module of claim 1 , wherein the thermally conductive structure is at least partially compressible.

3. The camera module of claim 2 , wherein the thermally conductive structure has two contacting surfaces respectively contacting the circuit board and the filter removable switch, and the two contacting surfaces are compressible.

4. The camera module of claim 1 , wherein the thermally conductive structure comprises at least one thermal pad.

5. The camera module of claim 4 , wherein a number of the at least one thermal pad is two, and the two thermal pads respectively contact the circuit board and the filter removable switch.

6. The camera module of claim 5 , wherein the two thermal pads are compressible.

7. The camera module of claim 5 , wherein the thermally conductive structure further comprises a metal block contacted between the two thermal pads, and the channel runs through the two thermal pads and the metal block.

8. The camera module of claim 7 , wherein a thickness of the metal block is greater than a thickness of each of the thermal pads.

9. The camera module of claim 7 , wherein a thermal conductivity of the metal block is greater than a thermal conductivity of each of the thermal pads.

10. The camera module of claim 1 , wherein the thermally conductive structure comprises:
a metal block thermally connected between the circuit board and the filter removable switch and having an inner wall surface forming at least a part of the channel; and
a light absorption layer completely coated on the inner wall surface.

11. The camera module of claim 1 , wherein the filter removable switch comprises a metal plate, and the filter removable switch contacts the thermally conductive structure with the metal plate.

12. The camera module of claim 1 , wherein the circuit board further has a metal circuit layer partially exposed from the surface of the circuit board and contacting the thermally conductive structure.

13. The camera module of claim 12 , wherein a portion of the metal circuit layer exposed from the surface of the circuit board has a closed ring shape.

Assignees

• Chicony Electronics Co Ltd

Inventors

• Chen Wei-Cheng
• Wang Tsung-You

Classifications

• H04N23/52 Primary

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N5/22521 Primary

  Electricity · mapped topic

• H04N5/2254

  Electricity · mapped topic