Pad removal method and device
US-2025033347-A1 · Jan 30, 2025 · US
This page is not indexed by search engines while we improve data quality.
Chen Chunhung patents
Chen Chunhung is listed as an inventor on 31 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Chunhung |
| Total patents | 31 |
| First publication | Jan 11, 2018 |
| Latest publication | Jan 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Irregular mechanical motion detection systems and method
US-12172262-B2 · Dec 24, 2024 · US
Method of using polishing pad
US-2024359288-A1 · Oct 31, 2024 · US
Pad removal method and device
US-12115767-B2 · Oct 15, 2024 · US
Method of using polishing pad
US-12070833-B2 · Aug 27, 2024 · US
Performing planarization process controls in semiconductor fabrication
US-12009221-B2 · Jun 11, 2024 · US
Method of using polishing pad
US-2023339068-A1 · Oct 26, 2023 · US
Irregular mechanical motion detection systems and method
US-2023330803-A1 · Oct 19, 2023 · US
Irregular mechanical motion detection systems and method
US-11731232-B2 · Aug 22, 2023 · US
Method of chemical mechanical polish operation and chemical mechanical polishing system
US-2023256561-A1 · Aug 17, 2023 · US
Recent patents
Latest publications not already listed above.
Method of using polishing pad
US-11691243-B2 · Jul 4, 2023 · US
Method for CMP pad conditioning
US-11679472-B2 · Jun 20, 2023 · US
Pad removal method and device
US-2023158791-A1 · May 25, 2023 · US
Pad removal method
US-11554578-B2 · Jan 17, 2023 · US
Pad removal method
US-2021229415-A1 · Jul 29, 2021 · US
Pad removal device and method
US-10987913-B2 · Apr 27, 2021 · US
Method of using polishing pad
US-2021069855-A1 · Mar 11, 2021 · US
Polishing pad and method of using
US-10864612-B2 · Dec 15, 2020 · US
Method for cmp pad conditioning
US-2020269384-A1 · Aug 27, 2020 · US
Apparatus and method for CMP pad conditioning
US-10675732-B2 · Jun 9, 2020 · US
Irregular mechanical motion detection systems and method
US-2020130130-A1 · Apr 30, 2020 · US
Performing Planarization Process Controls in Semiconductor Fabrication
US-2020051830-A1 · Feb 13, 2020 · US
Performing planarization process controls in semiconductor fabrication
US-10468270-B2 · Nov 5, 2019 · US
Pad removal device and method
US-2019248127-A1 · Aug 15, 2019 · US
Performing planarization process controls in semiconductor fabrication
US-2019164777-A1 · May 30, 2019 · US
Pad removal device and method
US-10272661-B2 · Apr 30, 2019 · US
Chemical mechanical polishing head
US-10155297-B2 · Dec 18, 2018 · US
Apparatus and method for cmp pad conditioning
US-2018297170-A1 · Oct 18, 2018 · US
Pad removal device and method
US-2018297350-A1 · Oct 18, 2018 · US
Polishing pad and method of using
US-2018161953-A1 · Jun 14, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 32 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B24B37/005 | 16 |
| B24B53/017 | 16 |
| B24B37/34 | 13 |
| B24B49/12 | 11 |
| B32B43/006 | 9 |