Method for CMP pad conditioning

Patent metadata

Field	Value
Publication number	US-11679472-B2
Application number	US-202016874403-A
Country	US
Kind code	B2
Filing date	May 14, 2020
Priority date	Apr 18, 2017
Publication date	Jun 20, 2023
Grant date	Jun 20, 2023

Abstract

A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.

First claim

What is claimed is:

1. A method of conditioning a polishing pad comprising:
positioning the polishing pad on a platen, the polishing pad having a polishing surface;
positioning a conditioning head to bring a conditioning pad into contact with the polishing surface;
generating a first pressure signal from a first pressure sensor, the first pressure signal is based on a force being applied to the polishing surface by the conditioning pad;
adjusting the positioning of the conditioning pad in response to evaluating the first pressure signal;
generating a surface condition signal, based on a signal from a surface condition sensor, in relation to a condition of the polishing surface;
removing debris from the polishing pad using a liquid from a flush solution dispenser mounted directly adjacent to the surface condition sensor; and
adjusting a vertical position of the conditioning pad responsive to the first pressure signal and the surface condition signal, wherein adjusting the vertical position of the conditioning pad comprises adjusting a vertical position of the surface condition sensor.

2. The method of conditioning the polishing pad according to claim 1 , further comprising:
rotating the polishing pad about a first axis; and
rotating the conditioning pad about a second axis, the first axis and second axis being parallel.

3. The method of conditioning the polishing pad according to claim 2 , further comprising:
translating the conditioning pad across the polishing surface.

4. The method of conditioning the polishing pad according to claim 1 , wherein positioning the conditioning head comprises positioning the conditioning head using a support arm, and adjusting the positioning of the conditioning pad comprises adjusting the positioning of the conditioning pad relative to the support arm.

5. The method of conditioning the polishing pad according to claim 4 , further comprising:
evaluating the surface condition signal against a surface condition signal target range; and
positioning the conditioning head to separate the conditioning pad from the polishing surface when the surface condition signal is within the surface condition signal target range.

6. A method of conditioning a polishing pad comprising:
positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of the polishing pad;
generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad;
generating a surface condition signal using an optical scanner;
removing debris from the polishing pad using a liquid from a flush solution dispenser mounted directly adjacent to the optical scanner; and
adjusting the positioning of the conditioning pad in response to the first pressure signal and the surface condition signal, wherein adjusting the positioning of the conditioning pad comprises adjusting positioning of the optical scanner.

7. The method of claim 6 , wherein adjusting the position of the conditioning pad comprises adjusting the positioning of the conditioning pad and adjusting the positioning of the optical scanner using a support arm.

8. The method of claim 6 , further comprising:
rotating the conditioning pad about a first axis; and
rotating the polishing pad about a second axis, wherein the first axis is offset from the second axis.

9. The method of claim 6 , further comprising separating the conditioning pad from the polishing pad in response to the surface condition signal indicating a surface condition within a target range.

10. The method of claim 6 , further comprising translating the conditioning pad across the polishing surface.

11. The method of claim 10 , wherein translating the conditioning pad comprises translating the conditioning pad in an arcuate direction.

12. The method of claim 10 , wherein translating the conditioning pad comprises translating the conditioning pad in a radial direction.

13. The method of claim 6 , wherein generating the surface condition signal comprises detecting a surface condition of the polishing pad at a location separated from the conditioning pad.

14. The method of claim 6 , further comprising dispensing a solution onto the polishing pad during rotation of the conditioning pad relative to the polishing pad.

15. A method of conditioning a polishing pad comprising:
positioning, using a support arm, a conditioning head to bring a conditioning pad into contact with a polishing surface of the polishing pad;
rotating the conditioning pad relative to the polishing pad;
determining a surface condition of the polishing pad using a surface condition sensor;
generating a pressure signal using a plurality of pressure sensors based on a force being applied to the polishing surface by the conditioning pad during the rotation of the conditioning pad, wherein the plurality of pressure sensors is between the support arm and the conditioning pad;
removing debris from the polishing pad using a liquid from a flush solution dispenser mounted directly adjacent to the surface condition sensor;
adjusting the positioning of the conditioning pad with respect to the support arm in response to the pressure signal; and
adjusting the positioning of the conditioning pad and the surface condition sensor using the support arm during a polishing process.

16. The method of claim 15 , wherein generating the pressure signal comprises determining a distribution of force applied across the conditioning pad.

17. The method of claim 15 , wherein determining the surface condition comprises determining the surface condition using the surface condition sensor, wherein the surface condition sensor comprises an optical scanner.

18. The method of claim 17 , wherein adjusting the positioning of the conditioning pad comprises adjusting the conditioning pad in response to a surface condition signal.

19. The method of claim 17 , further comprising separating the conditioning pad from the polishing pad in response to a surface condition signal indicating the surface condition is within a target range.

20. The method of claim 15 , further comprising dispensing a solution onto the polishing pad during rotation of the conditioning pad.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Chunhung
• Wang Sheng-Chen

Classifications

• B24B49/16

  taking regard of the load · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B49/12

  involving optical means · CPC title

• B24B49/18

  taking regard of the presence of dressing tools · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title