Performing planarization process controls in semiconductor fabrication

Patent metadata

Field	Value
Publication number	US-12009221-B2
Application number	US-201916656393-A
Country	US
Kind code	B2
Filing date	Oct 17, 2019
Priority date	Nov 30, 2017
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.

First claim

What is claimed is:

1. A system, comprising:
a chemical-mechanical-polishing (CMP) tool configured to polish a wafer, wherein a polishing of the wafer generates byproducts;
a byproduct-collection tool configured to collect at least some of the byproducts generated during the polishing of the wafer;
a sensor, an analyzer, and first computer configured to analyze the collected byproducts, wherein an analysis of the collected byproducts indicates:
a presence of an unexpected atomic element that corresponds to a contaminant material in the collected byproducts; or
an unexpected chronological sequence in which a plurality of atomic elements in the collected byproducts appear; and

an industrial-grade computer configured to instruct the CMP tool to adjust the polishing of the wafer based on the analysis of the collected byproducts indicating an error that includes a contamination of the CMP tool, an over-polishing of the wafer, or an under-polishing of the wafer.

2. The system of claim 1 , wherein:
the CMP tool includes a polishing unit configured to polish the wafer and a cleaning unit configured to clean the wafer;
the polishing unit generates a first byproduct as the wafer is polished;
the cleaning unit generates a second byproduct as the wafer is cleaned; and
the byproduct-collection tool is configured to collect either the first byproduct or the second byproduct, or both.

3. The system of claim 1 , wherein the byproduct-collection tool and the sensor, the analyzer, and the first computer are integrated into a single machine.

4. The system of claim 1 , wherein the sensor, the analyzer, or the first computer is configured to:
bombard the collected byproducts with a ray or a wave; and
analyze the bombarded byproducts to determine a presence of one or more atomic elements therein or a respective weighting of each of the one or more atomic elements therein.

5. The system of claim 1 , wherein the CMP tool is configured to polish a metal plug or a multilayer interconnect structure of the wafer, and wherein the analysis of the collected byproducts indicates:
a greater-than-expected concentration of a material that is a part of the metal plug or a part of the multilayer interconnect structure in the collected byproducts; or
an unexpected chronological sequence in which materials of the metal plug or materials of the multilayer interconnect structure appear in the collected byproducts.

6. The system of claim 1 , wherein the analysis of the collected byproducts further indicates that an endpoint of the polishing of the wafer has been reached, and wherein the industrial-grade computer is configured to instruct the CMP tool to at least temporarily suspend the polishing of the wafer based on the analysis of the collected byproducts.

7. The system of claim 1 , wherein the analysis of the collected byproducts further indicates the unexpected chronological sequence in which the plurality of atomic elements in the collected byproducts appear.

8. The system of claim 1 , wherein an analysis of the collected byproducts further indicates an absence of an expected atomic element in the collected byproducts.

9. A system, comprising:
a first tool configured to perform a chemical-mechanical-polishing (CMP) process to a wafer, wherein the first tool includes a polishing component and a cleaning component, and wherein the polishing component generates a polishing byproduct during the CMP process, and wherein the cleaning component generates a cleaning byproduct during the CMP process;
a second tool configured to capture samples of the polishing byproduct and the cleaning byproduct;
a third tool configured to shoot rays or waves to the captured samples and produce an analysis of a material composition of the captured samples based on a response of the captured samples to the rays or waves, wherein the analysis indicates:
a presence of an unexpected atomic element that corresponds to a contaminant material in the captured samples; or
an incorrect chronological sequence of a plurality of a plurality of different atomic elements in the captured samples; and

a fourth tool configured to determine a process condition of the CMP process based on the analysis, wherein the process condition includes a presence of a contaminant in the first tool, an over-polishing of the wafer, or an under-polishing of the wafer.

10. The system of claim 9 , wherein the third tool is configured to produce the analysis that includes a plurality of energy bands that each correspond to one of the different atomic elements in the captured samples, and wherein the analysis indicates a concentration of each different atomic element based on an intensity of the corresponding energy band, and wherein the energy band corresponding to the contaminant material exceeds one or more predefined intensity thresholds according to the analysis.

11. The system of claim 9 , wherein the analysis indicates the incorrect chronological sequence of the plurality of a plurality of different atomic elements in the captured samples.

12. The system of claim 9 , wherein the fourth tool is communicatively coupled to the first tool and configured to instruct the first tool to suspend or terminate the CMP process.

13. The system of claim 9 , wherein the analysis further indicates an absence of an expected atomic element in the captured samples.

14. A system, comprising:
a planarization tool configured to perform a planarization process to a wafer;
a byproduct-capture tool configured to capture samples of a byproduct generated as a part of the planarization process;
an e-sensor tool configured to analyze a content of the samples of the byproduct captured by the byproduct-capture tool, wherein the e-sensor tool is configured to detect, based on the content of the samples, a presence of a contaminant material in the samples or an incorrect chronological sequence in which each metallic atomic element of a plurality of metallic atomic elements appears in the samples; and
one or more computers configured to perform one or more process controls for the planarization process based on an analysis produced by the e-sensor tool regarding the presence of the contaminant material or the incorrect chronological sequence, wherein the analysis indicates a condition that includes: a contamination of the planarization tool, or that the wafer has been planarized too much or not enough.

15. The system of claim 14 , wherein:
the planarization tool comprises a chemical mechanical polishing tool that includes a polishing unit and a cleaning unit; and
the e-sensor tool is configured to analyze the byproduct generated by the polishing unit and the byproduct generated by the cleaning unit by:
applying a ray or wave to the captured samples of the byproduct; and
determining, based on a response of the captured samples of the byproduct to the applied ray or wave, what metallic atomic elements are included in the captured samples.

16. The system of claim 15 , wherein the e-sensor tool is configured to detect the incorrect chronological sequence in which each metallic atomic element of a plurality of metallic atomic elements appears in the samples.

17. The system of claim 16 , wherein the one or more computers are configured to determine, based on what metallic atomic elements are determined to be included in the captured samples, whether an end-point has been reached for a polishing process performed by the polishing unit or for a cleaning process performed by the cleaning unit.

18. The system of claim 14 , wherein the one or more computers

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Chunhung
• Wang Sheng-Chen
• Chuang Chin Wei

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P52/403 Primary

  of conductive or resistive materials · CPC title

• G06F11/07

  Responding to the occurrence of a fault, e.g. fault tolerance · CPC title

• B24B37/013

  Devices or means for detecting lapping completion · CPC title

• G01N1/10

  in the liquid or fluent state {(burettes, pipettes B01L3/02; sampling of ground water E02D1/06; metering by volume of fluids or fluent solid material G01F11/00, G01F13/00)} · CPC title