Method of using polishing pad

Patent metadata

Field	Value
Publication number	US-12070833-B2
Application number	US-202318341421-A
Country	US
Kind code	B2
Filing date	Jun 26, 2023
Priority date	Dec 14, 2016
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

First claim

What is claimed is:

1. A method of using a polishing pad, the method comprising:
applying a slurry to a first location on the polishing pad;
rotating the polishing pad;
spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region comprises a plurality of first grooves;
spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves; and
spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region comprises a plurality of third grooves.

2. The method of claim 1 , wherein spreading the slurry across the second region comprises spreading the slurry across the second region having a first material property of the first region that varies in a thickness direction of the polishing pad, each of the plurality of second grooves extends through at least two variations in the first material property, and the first material property comprises porosity, specific gravity or absorbance.

3. The method of claim 1 , wherein spreading the slurry across the third region comprises spreading the slurry across the plurality of third grooves, and each of the plurality of third grooves is wider than each of the plurality of second grooves.

4. The method of claim 1 , wherein spreading the slurry across the third region comprises spreading the slurry across the plurality of third grooves, and each of the plurality of third grooves is deeper than each of the plurality of second grooves.

5. The method of claim 1 , wherein spreading the slurry across the third region comprises spreading the slurry across the plurality of third grooves, and each of the plurality of third grooves is wider than each of the plurality of first grooves.

6. The method of claim 1 , wherein spreading the slurry across the third region comprises spreading the slurry across the plurality of third grooves, and each of the plurality of third grooves is deeper than each of the plurality of first grooves.

7. The method of claim 1 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region having a higher porosity than the second region.

8. A method of using a polishing pad, the method comprising:
applying a slurry to a first location on the polishing pad;
rotating the polishing pad;
spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region comprises a plurality of first grooves, and each of the plurality of first grooves has a first width and a first depth;
spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves, and each of the plurality of second grooves has a second width and a second depth; and
spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region comprises a plurality of third grooves, each of the plurality of third grooves has a third width and a third depth, and the third width is different from at least one of the first width or the second width.

9. The method of claim 8 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising the plurality of third grooves having the third depth different from at least one of the first depth or the second depth.

10. The method of claim 8 , wherein spreading the slurry across the second region comprises spreading the slurry across the second region comprising the plurality of second grooves having the second depth different from the first depth.

11. The method of claim 8 , wherein spreading the slurry across the second region comprises spreading the slurry across the second region comprising the plurality of second grooves having the second width different from the first width.

12. The method of claim 8 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region having a third porosity different from a first porosity of the first region and a second porosity of the second region.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Chunhung
• Li Jung-Yu
• Wang Sheng-Chen
• Huang Shih-Sian

Classifications

• B24B49/12

  involving optical means · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B53/017

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/10

  for single side lapping · CPC title

• B24B37/22

  characterised by a multi-layered structure · CPC title