Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors
US-12581600-B2 · Mar 17, 2026 · US
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Bunt Jay A patents
Bunt Jay A is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bunt Jay A |
| Total patents | 20 |
| First publication | Nov 17, 2020 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Filter device having multiple changeable filter surfaces
US-12274966-B2 · Apr 15, 2025 · US
Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors
US-2025089174-A1 · Mar 13, 2025 · US
Coolant-cooled heat sink(s) with associated ultra-violet light assembly
US-12005148-B2 · Jun 11, 2024 · US
High power device fault localization via die surface contouring
US-11940271-B2 · Mar 26, 2024 · US
Filter device having multiple changeable filter surfaces
US-2023381705-A1 · Nov 30, 2023 · US
Tamper-respondent assemblies with porous heat transfer element(s)
US-11716808-B2 · Aug 1, 2023 · US
Non-destructive bond line thickness measurement of thermal interface material on silicon packages
US-11614324-B2 · Mar 28, 2023 · US
Coolant-cooled heat sink(s) with associated ultra-violet light assembly
US-2022347327-A1 · Nov 3, 2022 · US
Lid/heat spreader having targeted flexibility
US-11430710-B2 · Aug 30, 2022 · US
Recent patents
Latest publications not already listed above.
Tamper-respondent assemblies with porous heat transfer element(s)
US-2022192011-A1 · Jun 16, 2022 · US
High power device fault localization via die surface contouring
US-2022155049-A1 · May 19, 2022 · US
Tamper-respondent assembly with structural material within sealed inner compartment
US-11191155-B1 · Nov 30, 2021 · US
Conformal integrated circuit (IC) device package lid
US-11158562-B2 · Oct 26, 2021 · US
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
US-11156409-B2 · Oct 26, 2021 · US
Conformal Integrated Circuit (IC) Device Package Lid
US-2021249333-A1 · Aug 12, 2021 · US
Lid/heat spreader having targeted flexibility
US-2021233825-A1 · Jul 29, 2021 · US
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
US-2021222956-A1 · Jul 22, 2021 · US
Non-destructive bond line thickness measurement of thermal interface material on silicon packages
US-2021123729-A1 · Apr 29, 2021 · US
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
US-10842043-B1 · Nov 17, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 20 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/22 | 10 |
| H10W40/70 | 6 |
| H05K1/0275 | 5 |
| H05K7/20772 | 5 |
| H10W40/77 | 4 |