Lid/heat spreader having targeted flexibility

Patent metadata

Field	Value
Publication number	US-11430710-B2
Application number	US-202016773937-A
Country	US
Kind code	B2
Filing date	Jan 27, 2020
Priority date	Jan 27, 2020
Publication date	Aug 30, 2022
Grant date	Aug 30, 2022

Abstract

An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

First claim

What is claimed is:

1. An electronic apparatus comprising:
a semiconductor device mounted to an electronic packaging substrate for receiving the semiconductor device; and
one-piece lid secured to the electronic packaging substrate and covering the semiconductor device, the one-piece lid having a zone of targeted flexibility,
wherein the lid comprises at least two opposed sides projecting from the lid in a direction perpendicular to a surface of the electronic packaging substrate, and wherein the zone of targeted flexibility comprises a notch in each of the two opposed sides such that the notches are aligned with each other and with a centerline of the semiconductor device.

2. The electronic apparatus of claim 1 wherein the lid comprises a third side and a fourth side opposed to the third side projecting from the lid in a direction perpendicular to the surface of the electronic packaging substrate, and wherein the zone of targeted flexibility further comprises a notch in each of the third and fourth opposed sides such that the notches in the third and fourth sides are aligned with each other and with a second centerline of the semiconductor device.

3. The electronic apparatus of claim 1 wherein the zone of targeted flexibility is a designed area at one or more targeted locations of the lid to increase flexibility of the lid at the one or more targeted locations of the lid.

4. An electronic apparatus comprising:
a plurality of semiconductor devices mounted to an electronic packaging substrate, the plurality of semiconductor devices placed closely to one another so that a gap between a pair of semiconductor devices is between 0.5 and 3 mm;
a lid having at least one zone of targeted flexibility directly over the gap between the pair of semiconductor devices; and
a first slot and a second slot each parallel to and spaced from the gap, the first slot being directly over a first semiconductor device of the pair of semiconductor devices and the second slot being directly over a second semiconductor device of the pair of semiconductor devices.

5. The electronic apparatus of claim 4 wherein the zone of targeted flexibility comprises a hinge that is parallel to the gap and is directly over the gap.

6. The electronic apparatus of claim 4 wherein the zone of targeted flexibility comprises a third slot that is parallel to the gap and is directly over the gap.

7. The electronic apparatus of claim 6 wherein the third slot is on a surface of the lid facing the plurality of semiconductor devices.

8. The electronic apparatus of claim 6 wherein the third slot is on a surface of the lid facing away from the plurality of semiconductor devices.

9. The electronic apparatus of claim 6 wherein the zone of targeted flexibility further comprising a fourth slot that is parallel to the gap and is directly over the gap such that the third slot is in a surface of the lid facing the plurality of semiconductor devices and the fourth slot is in a surface of the lid facing away from the plurality of semiconductor devices.

10. The electronic apparatus of claim 6 wherein the third slot is 30 to 90% of a thickness of the lid.

11. The electronic apparatus of claim 6 wherein the fourth slot is 30 to 90% of a thickness of the lid.

12. The electronic apparatus of claim 4 wherein the first slot and the second slot are in a surface of the lid facing away from the plurality of semiconductor devices and are over centerlines of the first semiconductor device and the second semiconductor device.

13. The electronic apparatus of claim 4 wherein the at least one zone of targeted flexibility is a designed area at one or more targeted locations of the lid to increase flexibility of the lid at the one or more targeted locations of the lid.

14. An electronic apparatus comprising:
a plurality of semiconductor devices mounted to an electronic packaging substrate, the plurality of semiconductor devices placed closely to one another so that a gap between a pair of semiconductor devices is between 0.5 and 3 mm; and
a lid having at least one zone of targeted flexibility directly over the gap between the pair of semiconductor devices.

15. The electronic apparatus of claim 14 wherein the zone of targeted flexibility comprises a hinge that is parallel to the gap and is directly over the gap.

16. The electronic apparatus of claim 14 wherein the zone of targeted flexibility comprises a first slot that is parallel to the gap and is directly over the gap.

17. The electronic apparatus of claim 16 wherein the first slot is on a surface of the lid facing the plurality of semiconductor devices.

18. The electronic apparatus of claim 16 wherein the first slot is on a surface of the lid facing away from the plurality of semiconductor devices.

19. The electronic apparatus of claim 16 wherein the zone of targeted flexibility further comprising second slot that is parallel to the gap and is directly over the gap such that the first slot is in a surface of the lid facing the plurality of semiconductor devices and the second slot is in a surface of the lid facing away from the plurality of semiconductor devices.

20. The electronic apparatus of claim 16 wherein the first slot is 30 to 90% of a thickness of the lid, and wherein the second slot is 30 to 90% of a thickness of the lid.

Assignees

• IBM

Inventors

• Li Shidong
• Bunt Jay A
• Marston Kenneth C
• Toy Hilton
• Zhang Hongqing
• Lewison David J

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/17

  characterised by their materials · CPC title