Conformal integrated circuit (IC) device package lid

Patent metadata

Field	Value
Publication number	US-11158562-B2
Application number	US-202016787241-A
Country	US
Kind code	B2
Filing date	Feb 11, 2020
Priority date	Feb 11, 2020
Publication date	Oct 26, 2021
Grant date	Oct 26, 2021

Abstract

An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

First claim

What is claimed is:

1. An electronic device comprising:
an IC device carrier;
an IC device connected to the upper surface of the IC device carrier, the IC device comprising a convex upper surface;
a conformable lid comprising an internal chamber, an internal chamber inlet, and a deformable floor, the deformable floor comprising a concave lower surface;
a thermal interface material (TIM) that connects the convex upper surface and the concave lower surface, the TIM comprising a uniform bond line thickness; and
a heatsink connected to an upper surface of the conformable lid, wherein the internal chamber inlet extends through a base of the heatsink.

2. The electronic device of claim 1 , further comprising:
liquid metal within the internal chamber.

3. The electronic device of claim 1 , further comprising:
a plurality of pins that each extend from a lower surface of the internal chamber.

4. The electronic device of claim 1 , further comprising:
one or more fins that extend from a lower surface of the internal chamber.

5. The electronic device of claim 2 , wherein the liquid metal is pressurized and wherein the internal chamber further comprises residual gas utilized to pressurize the liquid metal.

6. The electronic device of claim 1 , wherein conformable lid further comprises a lower portion and an upper portion.

7. The electronic device of claim 6 , wherein the lower portion comprises a plurality of stacked metal layers, wherein an upper surface of a first metal layer is diffusion bonded to a bottom surface of a second metal layer.

8. The electronic device of claim 3 , wherein the plurality of pins are located solely within a predetermined hotspot region of the lower surface of the internal chamber.

9. A method of achieving a uniform bond line thickness of a thermal interface material (TIM) between an integrated circuit (IC) device and a conformable lid that comprises a deformable floor, an internal chamber, and one or more stiffening elements extending from the deformable floor into the internal chamber, the method comprising:
allowing the deformable floor of the conformable lid to bend around a warped IC device, wherein the bent deformable floor comprises a concave lower surface, and wherein the TIM connects a convex upper surface of the warped IC device and the concave lower surface and comprises the uniform bond line thickness.

10. The method of claim 9 , wherein the internal chamber comprises liquid metal there within.

11. The method of claim 10 , wherein the one or more stiffening elements comprise a plurality of pins, wherein each of the plurality of pins extend from a lower surface of the internal chamber and is in conduction contact with the liquid metal.

12. The method of claim 10 , wherein the one or more stiffening elements comprises a plurality of fins, wherein each of the plurality of fins extend from a lower surface of the internal chamber and is in conduction contact with the liquid metal.

13. The method of claim 10 , wherein the liquid metal is pressurized and wherein the internal chamber further comprises residual gas utilized to pressurize the liquid metal.

14. The method of claim 9 , wherein conformable lid further comprises a lower portion and an upper portion.

15. The method of claim 9 , wherein the lower portion comprises a plurality of stacked metal layers, wherein an upper surface of a first metal layer is diffusion bonded to a bottom surface of a second metal layer.

16. The method of claim 11 , wherein the plurality of pins are located solely within a predetermined hotspot region of the lower surface of the internal chamber.

17. An electronic device fabrication method comprising:
connecting an integrated circuit (IC) device package to a motherboard;
connecting a heatsink to the upper surface of a conformable lid of the IC device package, wherein an inlet to an internal chamber of the conformable lid extends through a clearance hole within the heatsink; and
subsequent to connecting the heatsink to the upper surface of the conformable lid, injecting liquid metal into the internal chamber through the inlet.

18. The method of claim 17 , further comprising:
pressurizing the liquid metal within the internal chamber.

19. The method of claim 17 , wherein a thermal interface material connects the heatsink to the upper surface of the conformable lid and connects a sidewall of the inlet to the heatsink.

Assignees

• IBM

Inventors

• Lewison David J
• Zhang Hongqing
• Bunt Jay A
• Zitz Jeffrey A
• Iruvanti Sushumna

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/77

  Auxiliary members characterised by their shape · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/60 Primary

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/70 Primary

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title