System and method for generation of wafer inspection critical areas
US-11410291-B2 · Aug 9, 2022 · US
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Banerjee Saibal patents
Banerjee Saibal is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Banerjee Saibal |
| Total patents | 23 |
| First publication | Aug 4, 2015 |
| Latest publication | Aug 9, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
System and Method for Generation of Wafer Inspection Critical Areas
US-2020334807-A1 · Oct 22, 2020 · US
Shape metric based scoring of wafer locations
US-10714366-B2 · Jul 14, 2020 · US
System and method for generation of wafer inspection critical areas
US-10706522-B2 · Jul 7, 2020 · US
Criticality analysis augmented process window qualification sampling
US-10503078-B2 · Dec 10, 2019 · US
Shape metric based scoring of wafer locations
US-2019318949-A1 · Oct 17, 2019 · US
Virtual inspection systems with multiple modes
US-10416088-B2 · Sep 17, 2019 · US
Criticality analysis augmented process window qualification sampling
US-2019072858-A1 · Mar 7, 2019 · US
Image based specimen process control
US-10181185-B2 · Jan 15, 2019 · US
Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
US-10127651-B2 · Nov 13, 2018 · US
Recent patents
Latest publications not already listed above.
Reducing registration and design vicinity induced noise for intra-die inspection
US-10074167-B2 · Sep 11, 2018 · US
System and Method for Generation of Wafer Inspection Critical Areas
US-2018130195-A1 · May 10, 2018 · US
Shape based grouping
US-9965848-B2 · May 8, 2018 · US
Virtual inspection systems with multiple modes
US-2018052118-A1 · Feb 22, 2018 · US
Virtual inspection systems with multiple modes
US-9816939-B2 · Nov 14, 2017 · US
Outlier detection on pattern of interest image populations
US-9767548-B2 · Sep 19, 2017 · US
Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
US-2017206650-A1 · Jul 20, 2017 · US
Image based specimen process control
US-2017200264-A1 · Jul 13, 2017 · US
Shape based grouping
US-2017186151-A1 · Jun 29, 2017 · US
Reducing registration and design vicinity induced noise for intra-die inspection
US-2017161888-A1 · Jun 8, 2017 · US
Outlier Detection on Pattern of Interest Image Populations
US-2016314578-A1 · Oct 27, 2016 · US
Virtual Inspection Systems with Multiple Modes
US-2016025648-A1 · Jan 28, 2016 · US
Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology
US-9098891-B2 · Aug 4, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kla Tencor Corp | 25 |
| Kla Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T2207/30148 | 15 |
| H10P74/203 | 14 |
| G06T2207/10061 | 13 |
| G06T7/0006 | 9 |
| G06T7/0004 | 9 |