Power Semiconductor Device Package
US-2026101814-A1 · Apr 9, 2026 · US
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Balaraman Devarajan patents
Balaraman Devarajan is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Balaraman Devarajan |
| Total patents | 33 |
| First publication | May 17, 2018 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Metal nitride core-shell particle die-attach material
US-12588521-B2 · Mar 24, 2026 · US
Encapsulation delamination prevention structures at die edge
US-2026053057-A1 · Feb 19, 2026 · US
Power discrete package having symmetric pinouts and process of implementing the same
US-2025372520-A1 · Dec 4, 2025 · US
Wafer-Level Bond-Line Control
US-2025323130-A1 · Oct 16, 2025 · US
Electronic device with top side pin array and manufacturing method thereof
US-2025167007-A1 · May 22, 2025 · US
Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-2025149432-A1 · May 8, 2025 · US
Multifunctional Adhesion Promoter for Semiconductor Device Packages
US-2025122413-A1 · Apr 17, 2025 · US
Direct Bonded Semiconductor Die Package
US-2025125231-A1 · Apr 17, 2025 · US
Semiconductor Die Bonding
US-2025105196-A1 · Mar 27, 2025 · US
Recent patents
Latest publications not already listed above.
Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-12224233-B2 · Feb 11, 2025 · US
Semiconductor packages with increased power handling
US-12224218-B2 · Feb 11, 2025 · US
Submounts with Stud Protrusions for Semiconductor Packages
US-2025038055-A1 · Jan 30, 2025 · US
Electronic device with top side pin array and manufacturing method thereof
US-12205827-B2 · Jan 21, 2025 · US
Semiconductor package
US-D1056862-S · Jan 7, 2025 · US
Semiconductor Package
US-2024421029-A1 · Dec 19, 2024 · US
Power Semiconductor Devices Including Beryllium Metallization
US-2024355738-A1 · Oct 24, 2024 · US
Metal Nitride Core-Shell Particle Die-Attach Material
US-2024282741-A1 · Aug 22, 2024 · US
Electroless Die-Attach Process for Semiconductor Packaging
US-2024274514-A1 · Aug 15, 2024 · US
Semiconductor device packages including multilayer stacks with improved adhesion
US-2024258217-A1 · Aug 1, 2024 · US
Thermal Enhanced Power Semiconductor Package
US-2024243031-A1 · Jul 18, 2024 · US
Core-Shell Particle Die-Attach Material
US-2024182757-A1 · Jun 6, 2024 · US
Semiconductor packages with increased power handling
US-2023260861-A1 · Aug 17, 2023 · US
Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-2022238426-A1 · Jul 28, 2022 · US
Electronic device with top side pin array and manufacturing method thereof
US-2021043465-A1 · Feb 11, 2021 · US
Electronic device with top side pin array and manufacturing method thereof
US-10832921-B2 · Nov 10, 2020 · US
Electronic device with top side pin array and manufacturing method thereof
US-2019279882-A1 · Sep 12, 2019 · US
Electronic device with top side pin array and manufacturing method thereof
US-10304697-B2 · May 28, 2019 · US
Electronic device with top side pin array and manufacturing method thereof
US-2019109018-A1 · Apr 11, 2019 · US
Semiconductor device and method of manufacturing thereof
US-10157872-B2 · Dec 18, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Wolfspeed Inc | 21 |
| Amkor Technology Inc | 8 |
| Amkor Tech Singapore Holding Pte Ltd | 2 |
| Cree Inc | 1 |
| Amkor Tech Singapore Holding Pte Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/884 | 17 |
| H10W72/952 | 15 |
| H10W72/073 | 14 |
| H10W74/00 | 13 |
| H10W72/0198 | 13 |