Tungsten wordline fill in high aspect ratio 3d nand architecture
US-2026026324-A1 · Jan 22, 2026 · US
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Ba Xiaolan patents
Ba Xiaolan is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ba Xiaolan |
| Total patents | 30 |
| First publication | Jan 14, 2016 |
| Latest publication | Jan 22, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated high aspect ratio etching
US-2025391658-A1 · Dec 25, 2025 · US
Showerhead for substrate processing systems
US-2025179637-A1 · Jun 5, 2025 · US
Nucleation-free deposition
US-2025132201-A1 · Apr 24, 2025 · US
Nucleation-free tungsten deposition
US-12237221-B2 · Feb 25, 2025 · US
Tungsten deposition
US-12077858-B2 · Sep 3, 2024 · US
Multi-layer feature fill
US-2024282580-A1 · Aug 22, 2024 · US
Rapid flush purging during atomic layer deposition
US-12060639-B2 · Aug 13, 2024 · US
Atomic layer deposition on 3d nand structures
US-2024266177-A1 · Aug 8, 2024 · US
Multi-layer feature fill
US-12014928-B2 · Jun 18, 2024 · US
Recent patents
Latest publications not already listed above.
Atomic layer deposition on 3D NAND structures
US-11972952-B2 · Apr 30, 2024 · US
Low resistance pulsed cvd tungsten
US-2024006180-A1 · Jan 4, 2024 · US
Exclusion ring for substrate processing
US-2023260814-A1 · Aug 17, 2023 · US
Tungsten deposition
US-2022364232-A1 · Nov 17, 2022 · US
Nucleation-free tungsten deposition
US-2022254685-A1 · Aug 11, 2022 · US
Rapid flush purging during atomic layer deposition
US-2022186370-A1 · Jun 16, 2022 · US
Atomic layer deposition on 3d nand structures
US-2021335617-A1 · Oct 28, 2021 · US
Multi-layer feature fill
US-2021313183-A1 · Oct 7, 2021 · US
Forming low resistivity fluorine free tungsten film without nucleation
US-10546751-B2 · Jan 28, 2020 · US
Forming low resistivity fluorine free tungsten film without nucleation
US-2018240675-A1 · Aug 23, 2018 · US
Method of forming low resistivity fluorine free tungsten film without nucleation
US-9978605-B2 · May 22, 2018 · US
Tungsten films having low fluorine content
US-9754824-B2 · Sep 5, 2017 · US
Method of forming low resistivity fluorine free tungsten film without nucleation
US-2017117155-A1 · Apr 27, 2017 · US
Cu/barrier interface enhancement
US-9633861-B2 · Apr 25, 2017 · US
Deposition of low fluorine tungsten by sequential CVD process
US-9613818-B2 · Apr 4, 2017 · US
Enhancing electrical property and UV compatibility of ultrathin blok barrier film
US-9580801-B2 · Feb 28, 2017 · US
Tungsten films having low fluorine content
US-2016351444-A1 · Dec 1, 2016 · US
Deposition of low fluorine tungsten by sequential cvd process
US-2016351401-A1 · Dec 1, 2016 · US
Enhancing electrical property and uv compatibility of ultrathin blok barrier film
US-2016071724-A1 · Mar 10, 2016 · US
Enhancing uv compatibility of low k barrier film
US-2016013049-A1 · Jan 14, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 26 |
| Applied Materials Inc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/432 | 23 |
| H10W20/056 | 22 |
| C23C16/14 | 22 |
| H10W20/045 | 21 |
| C23C16/045 | 19 |