Cu/barrier interface enhancement

Patent metadata

Field	Value
Publication number	US-9633861-B2
Application number	US-201414180054-A
Country	US
Kind code	B2
Filing date	Feb 13, 2014
Priority date	Mar 12, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

Embodiments of the present invention provide processes to selectively form a metal layer on a conductive surface, followed by flowing a silicon based compound over the metal layer to form a metal silicide layer. In one embodiment, a substrate having a conductive surface and a dielectric surface is provided. A metal layer is then deposited on the conductive surface. A metal silicide layer is formed as a result of flowing a silicon based compound over the metal layer. A dielectric is formed over the metal silicide layer.

First claim

The invention claimed is:

1. A method for processing a substrate, comprising:
placing a substrate into a processing chamber, wherein the substrate comprises a conductive contact disposed within a dielectric layer, wherein the conductive contact is separated from the dielectric layer by a barrier layer, wherein the conductive contact comprises copper;
depositing a cobalt layer over the conductive contact, wherein the cobalt layer is in contact with the conductive contact;
flowing a silicon based compound over the cobalt layer to form a cobalt silicide layer, wherein the cobalt silicide layer is in contact with the cobalt layer; and
depositing a dielectric barrier layer over the cobalt silicide layer.

2. The method of claim 1 , wherein the depositing the cobalt layer comprises exposing the substrate to a cobalt precursor gas to selectively forming the cobalt layer over the conductive contact while leaving exposed the dielectric surface.

3. The method of claim 2 , wherein the cobalt precursor gas comprises a cobalt precursor which has the general chemical formula (CO) x Co y L z , wherein:
X is 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12;
Y is 1, 2, 3, 4, or 5;
Z is 1, 2, 3, 4, 5, 6, 7, or 8; and
L is a ligand independently selected from the group consisting of cyclopentadienyl, alkylcyclopentadienyl, methylcyclopentadienyl, pentamethylcyclopentadienyl, pentadienyl, alkylpentadienyl, cyclobutadienyl, butadienyl, allyl, ethylene, propylene, alkenes, dialkenes, alkynes, nitrosyl, ammonia, derivatives thereof, and combinations thereof.

4. The method of claim 1 , wherein the silicon based compound is selected from the group comprising silane (SiH 4 ), disilane (Si 2 H 6 ), trisilane (Si 3 H 8 ), trisilylamine (TSA), derivatives thereof, and combinations thereof.

5. The method of claim 1 , wherein the dielectric barrier layer comprises silicon carbide, silicon nitride, silicon oxide, silicon oxynitride, silicon carbide oxide or carbon doped silicon oxide material, derivatives thereof, or combinations thereof.

6. A method for processing a substrate, comprising:
providing a substrate comprising a copper surface and a dielectric surface;
depositing a cobalt layer over the copper surface;
flowing trisilyamine (TSA) over the cobalt layer to form a cobalt silicide; and
depositing a silicon carbon nitride (SiCN) layer over the cobalt silicide layer.

7. The method of claim 6 , wherein the depositing the cobalt layer comprises exposing the substrate to a cobalt precursor gas to selectively forming the cobalt layer over the copper surface while leaving exposed the dielectric surface.

8. The method of claim 7 , wherein the cobalt precursor gas comprises a cobalt precursor which has the general chemical formula (CO) x Co y L z , wherein:
X is 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12;
Y is 1, 2, 3, 4, or 5;
Z is 1, 2, 3, 4, 5, 6, 7, or 8; and
L is a ligand independently selected from the group consisting of cyclopentadienyl, alkylcyclopentadienyl, methylcyclopentadienyl, pentamethylcyclopentadienyl, pentadienyl, alkylpentadienyl, cyclobutadienyl, butadienyl, allyl, ethylene, propylene, alkenes, dialkenes, alkynes, nitrosyl, ammonia, derivatives thereof, and combinations thereof.

Assignees

• Applied Materials Inc

Inventors

• Ye Weifeng
• Shek Mei-Yee
• Balseanu Mihaela
• Zhang Xiaojun
• Ba Xiaolan
• Jin Yu
• Xia Li-Qun

Classifications

• H10W20/0372

  comprising multiple barrier, adhesion or liner layers · CPC title

• H10W20/077

  on sidewalls or on top surfaces of conductors (H10W20/076 takes precedence) · CPC title

• H10W20/0526

  by thermal treatment thereof · CPC title

• H10W20/0523

  by irradiating with ultraviolet or particle radiation · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title