Multi-chip package and method of providing die-to-die interconnects in same
US-2024429173-A1 · Dec 26, 2024 · US
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Au Hinmeng patents
Au Hinmeng is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Au Hinmeng |
| Total patents | 13 |
| First publication | May 24, 2018 |
| Latest publication | Dec 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-chip package and method of providing die-to-die interconnects in same
US-12113026-B2 · Oct 8, 2024 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2024038671-A1 · Feb 1, 2024 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-11876053-B2 · Jan 16, 2024 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-11824008-B2 · Nov 21, 2023 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2023016326-A1 · Jan 19, 2023 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2021134726-A1 · May 6, 2021 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-10923429-B2 · Feb 16, 2021 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2020357747-A1 · Nov 12, 2020 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-10763216-B2 · Sep 1, 2020 · US
Recent patents
Latest publications not already listed above.
Multi-chip package and method of providing die-to-die interconnects in same
US-2020075493-A1 · Mar 5, 2020 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-10510669-B2 · Dec 17, 2019 · US
Multi-chip package and method of providing die-to-die interconnects in same
US-2018145031-A1 · May 24, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 13 |
| H10W72/851 | 13 |
| H10W70/618 | 13 |
| H10W90/293 | 13 |
| H10W70/682 | 13 |